Robert Boschgmbh

Andreas Duell

Joerg Muchow

Helmut Grutzeck

Jochen Franz

Rainer Straub

Frederic Njikam Njimonzie

Johannes Baader

Stefan Pinter

Karl Bender

Christoph Schelling

Frank Fischer

Heribert Weber

Hubert Benzel

Hans Hecht

Simon Armbruster

Kurt Weiblen

Ulrich Wagner

Hans-Peter Trah

Arne Dannenberg

Matthias Kuesell

Mike Schwarz

Zoltan Lestyan

Winfried Bernhard

Ralf Hausner

Matthias Fuertsch

Rainer Schink

Sebastian Reiss

Andreas Stratmann

Stefan Zehringer

Uwe Lipphardt

Stefan Mark

Kurt Ingrisch

Detlef Gruen

Stephan Oppl

Roland Müller-Fiedler

Wolfgang Romes

Botho Ziegenbein

Soeren Zimmermann

Kay Borchert

Stefan Liebing

A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

Linearized micromechanical sensor

A micromirror assembly is described as including a spring-mounted mirror and at least one stop unit, which is designed to restrict a movement of the mirror in the event of a movement of the mirror in a predefined direction out of its idle position. Furthermore, the invention relates to a projection device.

Micromirror arrangement and projection device

A micromirror device including a drive unit, which includes a movable drive element, which is situated in a first plane, and a guiding device, and a mirror, which is elastically coupled to the drive element and is situated in the idle position in a second plane, which is in parallel to the first plane, the guiding device being designed to guide a movement of the drive element on a straight line situated in the first plane. Furthermore, a corresponding projection device is described.

Micromirror device and projection device

An apparatus for eutectic bonding includes (a) a bonding frame that includes two substrates and (b) a frame device situated on the substrates, the frame device including two frames, the apparatus being usable to develop a eutectic, formed during bonding, in a spatially defined manner, whereby a volume formed by the frames and the substrates can be filled up completely with the eutectic.

Apparatus for eutectic bonding

A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.

Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting

A micromechanical component includes: at least one micromirror; and an integrated photodiode. The micromechanical component is part of a microprojector which further includes a light source. The integrated photodiode of the micromechanical component receives light from the light source.

Micromechanical component including an integrated photodiode and a microprojector

A connecting structure for micromechanical oscillating devices, in particular micromechanical oscillating mirrors. The connecting structure is at least indirectly connectable to a micromechanical oscillating structure, on the one hand, and to an elastic element, on the other hand, for measuring torsions of the micromechanical oscillating structure, and includes at least one, in particular at least two, preferably three, legs which are situated parallel to a rotation axis of the micromechanical oscillating structure, and at least one further leg which is situated perpendicularly to the rotation axis. The extension of the connecting structure parallel to the rotation axis has at least two-and-a-half times, in particular three times, the extension of the connecting structure perpendicular to the rotation axis, and includes at least one resistance element for measuring torsions of the connecting structure, the resistance element being situated in the area of increased mechanical stress when the connecting structure undergoes torsion.

Connecting structure for micromechanical oscillating devices

A micromechanical sensor and a method for manufacturing a micromechanical sensor which has at least one membrane are provided. The membrane is made of a first material which is accommodated in a surrounding second material, and the membrane is configured for sensing a medium surrounding it. The membrane is reinforced, at least partly, by a third material at break-sensitive points on the membrane rim. Reinforcement of the membrane rim increases the stability and thus also the service life of the membrane and the sensor.

Membrane sensor

A micromechanical component, in particular a pressure sensor, including a substrate that has a membrane region, a surrounding region of the membrane region, at least one measuring resistance provided in the membrane region and modifiable by deformation of the membrane region, and a corresponding evaluation circuit provided in the surrounding region. An interference effect on the measuring resistance is producible by way of a deformation of parts, in particular conductor paths, of the evaluation circuit relative to the substrate. The invention also creates a corresponding equalization method on a test chip or as an individual final equalization.

Micromechanical component and equalization method

Pressure sensor

A pressure sensor for pressure detection in a combustion chamber of internal combustion engines of motor vehicles has a housing provided with an opening, a measuring element, a plunger arranged in the opening of the housing and having one end acting on the measuring element so that a measuring signal is produced proportionally to a pressure to be determined, the plunger directly abutting against the measuring element and having a material with a yielding point which is smaller than a breaking limit of a material of the measuring element, the end of the plunger which acts on the measuring element is spherical and abuts against the measuring element with such a contact surface that occurring stresses do not exceed a predetermined nominal value.

Pressure sensor for pressure detection in combustion chamber of internal

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Stuttgart, Germany

Andreas Duell