Robert Boschgmbh

Andreas Blum

Matthias Ludwig

Christian Ohl

Peter Kunert

Matthias Waibler

Thomas Schrimpf

Martin Rojahn

Matthias Taglieber

Eberhard Haiss

An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.

Electronic component having a molded component housing

The invention relates to a device () for encapsulating a component () with plastic material (), comprising at least two tool parts (), which in a closed arrangement for encapsulating the component () form a receptacle () for the component (), an injection channel () for supplying the liquefied plastic material () to the region of the receptacle (), and a single retaining element () for positioning the component () in the receptacle (), wherein the retaining element () can be moved in a first position for positioning the component () in the receptacle () and in a second position for preferably completely encapsulating the component () with the plastic material (). According to the invention, the retaining element () holds the component () in the region of the receptacle () by means of form positive and/or clamping engagement.

Device for encapsulating a component with plastics material

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Reutlingen, Germany

Andreas Blum