Leica Microsystems Jena Gmbh

Integrated Dynamics Engineering Gmbh

Brooks Automation Gmbh

Vistec Semiconductor Systems Gmbh

Jenoptik Gmbh

Jenoptik Technologie Gmbh

Sam Technologies Gmbh

Andreas Birkner

Peter Heiland

Knut Hiltawski

Frank Bernhardt

Andreas Mages

Klaus Schultz

Joachim Wienecke

Werner Scheler

Alfred Schulz

Arndt Evers

Wolfgang Vollrath

Berndt Lahne

Karsten Urban

Erich Adler

Michael Hofmann

Simon Schadt

Juergen Graefe

Ralf Langenbach

Dominik Grau

Roland Kappel

The present disclosure relates to a device and to a method for imaging an object in at least two views. The device and the method can be used, for example, for teaching-in or monitoring a robot or for monitoring handling systems or, more generally, with devices which require imaging of an object for an analysis or a monitoring process. The device allows an object to be imaged in at least two different views simultaneously, comprising at least one imaging optical element and at least one reflective element, wherein the reflective element is at least partly arranged within an object space of the imaging optical element, an optical axis of the imaging optical element being associated with a first view of the object, and wherein the reflective element is operable to image a second view of the object, which is different from the first view.

Device and method for imaging an object in at least two views

A method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine, wherein a computer-supported process is used to determine the presence and/or position and/or orientation of the substrate. Further, a system designed to execute the method. The computer-supported process includes an artificial neural network.

Method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine

A maintenance apparatus, in particular for lifting and moving components of a system for processing semiconductor devices. The apparatus comprises a beam and an arm with means for lifting a component, the arm being mounted to the beam via a connecting unit and so as to be pivotable in a horizontal plane, wherein the connecting unit is displaceable along the beam, and wherein the arm is displaceable perpendicularly to the beam, and wherein a load accommodation means is provided on the pivotable arm.

Maintenance apparatus

A device for evaluating defects in the edge area of a wafer () is disclosed. The evaluation may also be performed automatically. In particular, the device includes three cameras (), each provided with an objective (), wherein a first camera () is arranged such that the first camera () is opposite to an edge area on the upper surface () of the wafer (), wherein a second camera () is arranged such that the second camera () is opposite to a front surface () of the wafer (), and wherein a third camera () is arranged such that the third camera () is opposite to an edge area on the lower surface () of the wafer ().

Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers

The invention relates to an arrangement for transporting and inspecting semiconductor substrates (), having at least three workstations (), a changer (), which has at least three arms () which are designed to load the individual workstations () with semiconductor substrates (). A measuring device () is assigned to the second workstation (), determines the deviation of the current position of the semiconductor substrate () and makes it available to the arrangement () for the further inspection of the semiconductor substrate (). In addition, the changer () is not equipped with means for exact positioning of the semiconductor substrates () in the workstations ().

Method and arrangement for transporting and inspecting semiconductor substrates

The invention is based on a substrate conveying module () for conveying substrates into a workstation () for inspection, measurement, or processing of the substrates, in which on because of connecting elements () in at least two side walls () of the substrate conveying module () and/or in at least two side walls () of the workstation (), the substrate conveying module () can, at the installation location of the workstation (), be flexibly connected thereto in different orientations with respect to the workstation () and/or can be coupled at different points to the workstation ().

Substrate conveying module and system made up of substrate conveying module and workstation

An arrangement for the identification of a substrate (S) having at least one identification marking (I), comprising A corresponding identification method is also described.

Arrangement and method for the identification of substrates

The invention relates to an arrangement for transporting and inspecting semiconductor substrates ( ), having at least three workstations ( ), a changer ( ), which has at least three arms ( ) which are designed to load the individual workstations ( ) with semiconductor substrates ( ). A measuring device ( ) is assigned to the second workstation ( ), determines the deviation of the current position of the semiconductor substrate ( ) and makes it available to the arrangement ( ) for the further inspection of the semiconductor substrate ( ). In addition, the changer ( ) is not equipped with means for exact positioning of the semiconductor substrates ( ) in the workstations ( ).

In a device for manipulating an object for loading and unloading a clean room, the problem is to reduce the hardware expense for adjustment devices and for air conditioning while maintaining ergonomic benefits and to further improve the clean room conditions in the device. The device contains a stationary outer part ( ) of a housing ( ) as well as an inner part ( ) that can extend telescopically from it and a receptacle element ( ) in the roof area of the inner part ( ). For the telescopic extension of the inner part and for the lowering of the receptacle element into the inner part, a common guide rail ( ) and a common drive ( ) are provided. The receptacle element connected to the drive engages with a driver of the inner part for the telescopic extension of the inner part by vertical upward movement and after reaching an access level (E , E ), at which the inner part is secured, it can be lowered in the inner part. The inner part is flushed with an air flow coming from the clean room in the region of each level. The device is used for loading and unloading of clean rooms with objects that are transported in a container.

Device for manipulating an object for loading and unloading a clean room

The object of a device for transferring a transport object between two end positions is to exclude negative influences on dependability and clean room conditions, also in lengthy transport paths, while ensuring a highly flexible transfer. To control the operation of sensors and actuators at a movable part of a drive serving to transfer, electrical contact between these sensors and actuators and a supply unit located in a stationary part of the drive is effected exclusively in the two end positions. The device is provided in particular for use in the manufacture of semiconductors, e.g., for charging semiconductor processing machines, but is not limited to this field.

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Jena, Germany

Andreas Birkner