Apple Inc.

Luxvue Technology Corporation

Fujifilm Dimatix, Inc.

Fujifilm Corporation

Raster Graphics Inc.

Other

Dimatix, Inc.

Precision Image Corporation

Tacta Systems Inc.

Heidelberger Druckmaschinen Ag

Spectra, Inc.

Topaz Technologies, Inc.

Andreas Bibl

John A Higginson

Hsin-Hua Hu

Kapil Vinod Sakariya

Paul A Hoisington

Dariusz Golda

Kevin Von Essen

Hung-Fai Stephen Law

Kelly C McGroddy

Charles R Griggs

Deane Gardner

Jeffrey Birkmeyer

Vikram Pavate

Mats G Ottosson

Stephen Paul Bathurst

Paul Argus Parks

James Michael Perkins

Christoph Menzel

Clayton Ka Tsun Chan

Melvin L Biggs

Zhenfang Chen

John C Batterton

Nile Alexander Light

Stephen R Deming

Ion Bita

Edward Russell Moynihan

Gene F Day

Robert A Hasenbein

Daniel Arthur Haeger

Gregory De Brabander

Kevin K C Chang

John H Higginson

Jonathan S Steckel

James E Pedder

Sajjad Ali Khan

Jean-Jacques P Drolet

David Albertalli

Mark Nepomnishy

George H Fellingham

Elmar Gehlen

Patrick J Czarnota

Martin Schoeppler

Roland Van Gelder

Antai Xu

Nobuo Matsumoto

Steven H Barss

Tore Nauta

Shinya Sugimoto

Gregory DeBrabander

Hyeun-Su Kim

Yoshimasa Okamura

Robert B Martin

Joseph Kennelly-Ullman

Brian Walsh

Daniel Alan West

Tsan Y Chan

Xia Li

Imran Hashim

Zhibing Ge

Xiaofeng Fan

Yuan Chen

Nahid Harjee

Arman Hajati

Darren Todd Imai

Dmitry S Sizov

Lai Wang

Michael J Rocchio

Thomas Charisoulis

Xiaobin Xin

Daniel A Cote

Jon A Williams

Sandra J Graveson

Steve Deming

Alan Menard

David A Swett

Corina Nistorica

Vaibhav D Patel

Clayton K Chan

Chae Hyuck Ahn

Michael Ducker

Micheal Rocchio

Shenshen Zhao

Deane A Gardner

Higginson, John A

Robert Wells

Sumant Sood

David Weisberg

Patrick M Smith

Kelly Mcgroddy

Mats Ottosson

Michael Rocchio

Gregory Debrabander

Danielalan West

Gregory De Branbander

Russ Yarp

Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.

Embedded digital sensor structure

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

Light emitting device reflective bank structure

A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Display and micro device array for transfer to a display substrate

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Smart pixel lighting and display microcontroller

A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.

Micro device mass transfer tool

A wearable device may include an article configured to be worn by a user and a sensor array coupled with the article. The sensor array may be configured to obtain force data, among other data. A system can receive information generated by the wearable device utilized to perform a task. The information may include motion data indicating a motion of the wearable device and the force data indicating a force applied to the wearable device. The force data may be obtained from the sensor array generating digital outputs. The system can control a robotic device to perform a robotic motion based on the motion data and apply a robotic force based on the force data to repeat the task. The robotic device may include a sensor array to determine a force applied to the robotic device for controlling the robotic force. Other aspects are also described and claimed.

Tactile robotic training platform

Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Light emitting structure

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Display module and system applications

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

Donor substrate micro device stabilization structures and display structures are described. In an embodiment, a patterned electrically conductive layer is used to stabilize an array of micro devices on donor substrate with a plurality of tethers, which can be broken during a transfer sequence to transfer the array of micro devices from the donor substrate.

Nano-tether micro LED structure

Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

LED with internally confined current injection area

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Light emitting diode display with redundancy scheme

Growing community of inventors

Los Altos, CA, United States of America

Andreas Bibl