Ems-patent Ag

Ems-chemie Ag

Andreas Bayer

Botho Hoffmann

Nikolai Lamberts

Manfred Hewel

Oliver Thomas

Arda Alkan

Andri Cadalbert

Heinz G Hoff

Georg Stoppelmann

Philipp Harder

Georg Stöppelmann

Christian Schubert

Hanns-Jörg Liedloff

Pierre Dübon

Heinz Hoff

Mark Dipl-Ing Pfleghar

The present invention relates to polyamide compounds having high heat aging resistance which, in addition to a specific polyamide, comprise at least one unsubstituted or substituted metallocene, optionally at least one impact modifier and optionally at least one additive. The invention also relates to the use of said polyamide compounds for the production of molds.

Polyamide compounds, molds produced therefrom and use of the polyamide compounds

The present invention relates to filled polyamide moulding compounds with a high heat-ageing resistance which, besides a specific polyamide mixture, also comprise at least one filler, at least one unsubstituted or substituted metallocene and optionally at least one additive. The invention also relates to the use of these polyamide moulding compounds to produce moulded articles.

Filled polyamide moulding compounds, moulded articles produced therefrom, and use of the filled polyamide moulding compounds

The invention relates to a polyamide moulding compound consisting of the following components: (A) 35-68 wt. % of at least one semi-crystalline, semi-aromatic, thermoplastic polyamide based on aliphatic diamines with 4-8 carbon atoms with a melting temperature of at least 270&#xb0; C.; (B) 15-22 wt. % carbon fibres; (C) 18-30 wt. % glass fibres; (D) 1-10 wt. % of an impact-resistance modifier that is different from (E) and/or polymers that are different from (A), (E) and (F); (E) 0-10 wt. % ethylene-vinyl acetate copolymer; and (F) 0-3 wt. % additives. In this way, the sum of the components (A)-(F) is 100 wt. %, the sum of the components (B)-(C) is in the range of 33-48 wt. %, and the sum of the components (D)-(E) is in the range of 2-12 wt. %. The moulding compound permits the production of dimensionally stable, electrically conductive components, e.g. for the automotive sector and for contact with fuels, in particular methanol-containing petrol.

Conductive thermoplastic polyamide molding compound

Disclosed is a polyamide moulding compound formed from a mixture of partially crystalline, aliphatic polyamides and partially crystalline, partially aromatic polyamides and also fibrous reinforcing materials. The partially crystalline, partially aromatic polyamides are thereby formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or &#x3c9;-amino acid component. The mixture and/or the moulding compound can include further components. Moulded articles produced from these moulding compounds are used, for example, in the automobile sphere, in the household sphere, in measuring, regulating and control technology or in mechanical engineering.

Polyamide moulding compound and moulded articles produced therefrom

The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

Polyamide molding compounds and molded articles produced therefrom

Polyamide moulding composition in particular for railway applications consisting of:

Flame-retardant polyamide 12 moulding composition for railway applications

The invention relates to copolyamides which are formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or &#x3c9;-amino acid component. Furthermore, the invention relates to a polyamide moulding compound which comprises at least one of these copolyamides. Moulded articles produced from these moulding compounds are used in the automobile field, in the domestic field, in measuring-, regulating- and control technology or in mechanical engineering.

Copolyamides, moulding compounds comprising these and moulded articles produced therefrom

The present invention relates to polyamide molding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to molded articles produced from these polyamide molding compounds as components in the automobile or electrics/electronics sector.

The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

Polyamide molding material and moldings manufactured from same

A polyamide molding composition and uses thereof, and moldings produced therefrom, comprising the following components:

Polyamide moulding compositions, process for production thereof and use of these polyamide moulding compositions

Flowable polyamides

The invention relates to a flame-retardant polyamide molding composition based on semicrystalline polyamides. This polyamide molding composition is based on

Flame-protected, partially aromatic polyamide molding compounds

An unreinforced, halogen-free polyamide moulding composition having the following composition: (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a melting point of 270&#xb0; C. to 320&#xb0; C. and made up of 100% by weight of diacid fraction composed of: 50-100% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 0-50% by weight of isophthalic acid (IPA), and 100% by weight of diamine fraction; (B) 5-15% by weight of ionomer; (C) 8-18% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.

Partially aromatic polyamide moulding compositions and their uses

What is described is a polyamide molding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.5, where the polyamide molding material may optionally comprise customary additives (E) in addition to components (A) to (D), and where the amount thereof is in addition to the sum of components (A) to (D).

Polyamide moulding material and use thereof for production of LED housing components

A polyamide molding composition with the following constitution is described: Uses of this type of molding composition are also described, in particular for the production of a fuel line, cooling line, oil line or urea line for the automobile sector, as also are production processes to give moldings.

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Domat/Ems, Switzerland

Andreas Bayer