Rockwell Automation Technologies Incorporated

Baldor Electric Company

Andreas A Meyer

Lawrence D Radosevich

Daniel G Kannenberg

Bruce C Beihoff

Neil Gollhardt

Dennis L Kehl

Steven C Kaishian

Lee A Gettelfinger

Timothy A Roebke

Boris A Shoykhet

Qimin Dong

Richard F Schiferl

Michael Brinkmann

An electric machine has a stator that comprises a plurality of laminations with teeth and cooling apertures about a central opening. When the laminations are stacked to form the stator core, the teeth of adjacent laminations cooperate to form slots disposed circumferentially about the central opening that are configured to receive a plurality of stator windings, and the cooling apertures angularly spaced about the central opening cooperate to form cooling manifolds that extend along a length of the stator core. A portion of the laminations has their cooling apertures offset from other laminations in the stack in a manner to create a plurality of flow paths transverse to the manifolds. The transverse flow paths extend angularly between laminations and adjacent manifolds. A header assembly directs flow into and out of the stator core.

Micro-channel heat exchanger for stator of electrical machine with supply header

A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.

Power electronic switching device with laminated bus

Bus structure for power switching circuits

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Electrical power converter method and system employing multiple output converters

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Power converter having improved fluid cooling

An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Vehicle drive module having improved cooling configuration

Electrical power converter method and system employing multiple-output converters

An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Compact vehicle drive module having improved thermal control

Modular power converter having fluid cooled support

An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

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Richmond Heights, OH, United States of America

Andreas A Meyer