Samsung Electronics Co., Ltd.

Chippac, Inc.

Andrea Y Chen

Chung Y Lau

Daniel Babitch

Bhaskar Nallapureddy

Rajendra D Pendse

Samuel Waising Tam

Nazir Ahmad

Kyung-Moon Kim

Young Do Kweon

An electronic device, a method, and a chipset for receiving global navigation satellite system (GNSS) signals are provided. An input/output (I/O) mixer including a first multiplier and a second multiplier downconverts a modulated radio frequency wave to an intermediate frequency. The modulated radio frequency wave is input to first inputs of the first multiplier and the second multiplier, and where an in-phase signal, from a first digital to analog converter (DAC), and a quadrature phase signal, from a second DAC, are input to second inputs of the first multiplier and the second multiplier, respectively. A mixer imbalance between the first mixer and the second mixer is reduced using direct current (DC) bias voltages from the first DAC and the second DAC. The DC bias voltages are determined based on a first and second DAC codes of the first and second DACs. The downconverted modulated radio frequency wave is filtered.

Method and apparatus for second order intercept point (IP2) calibration

An electronic device, a method, and a chipset for receiving global navigation satellite system (GNSS) signals are provided. The electronic device includes a processor configured to: downconvert, by an input/output (I/O) mixer including a first multiplier and a second multiplier, a modulated radio frequency wave to an intermediate frequency, where the modulated radio frequency wave is input to first inputs of the first multiplier and the second multiplier, and where an in-phase signal and a quadrature phase signal based on a square wave are input to second inputs of the first multiplier and the second multiplier, respectively; filter the downconverted modulated radio frequency wave; and convert the filtered downconverted modulated radio frequency wave to a digital signal.

A method and apparatus is provided. The apparatus a processor configured to generate a first square wave, generate a second square wave, wherein the first square wave and the second square wave are driven by a reference frequency oscillator, modulate a radio frequency wave with the first square wave, downconvert the modulated radio frequency wave to an intermediate frequency, filter the downconverted modulated radio frequency wave, convert the filtered downconverted modulated radio frequency wave to a digital signal, and integrate the digital signal.

A flip chip package is formed by a solid-state bond technique for connecting the input/output pads on the integrated circuit chip and the package substrate. The solid-state bond technique involves a direct mating of metal surfaces, and does not employ any particulate conductive material nor any melting or flow of any interconnecting material. Accordingly the connections can be formed at very fine geometries. In another aspect, the space between the surface of the integrated circuit chip and the subjacent surface of the package substrate is filled with a patterned adhesive structure, which consists of one or more adhesive materials that are deployed in a specified pattern in relation to the positions of the second level interconnections between the package and the printed circuit board.

Growing community of inventors

San Jose, CA, United States of America

Andrea Y Chen