Gould Electronics Inc.

Gould Inc.

Andrea M Kovacs

Charles A Poutasse

James R Winchester

Katherine V Sack

This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formula

Epoxy adhesives and copper foils and copper clad laminates using same

This invention relates to a foil having an adhesion promoting layer overlying at least one side of said foil. The adhesion promoting layer is suitable for enhancing adhesion between the foil and another substrate. The adhesion promoting layer is derived from a composition comprising silanes (A) and (B). Silane (A) is at least one compound represented by the formula ##STR1## wherein G.sup.1, G.sup.2, G.sup.3, G.sup.4, G.sup.5 and G.sup.6 are independently halogen, hydrocarbyloxy, or hydroxy groups; R.sup.1 is a hydrocarbon group or nitrogen-containing hydrocarbon group; and n is zero or 1. Silane (B) is at least one compound represented by the formula ##STR2## wherein R.sup.2 is an organofunctional group, said organofunctional group being reactive with or having an affinity for said another substrate; and G.sup.7, G.sup.8 and G.sup.9 are independently halogen, hydrocarbyloxy, or hydroxy groups.

Foil with adhesion promoting layer derived from silane mixture

This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunetional epoxy resin and (B-2) at least one compound represented by the formula

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Bay Village, OH, United States of America

Andrea M Kovacs