Rhone-Poulenc Chimie

Rhodia Chimie

Andre Soldat

Jean-Marc Frances

Christian Priou

Francois Chizat

Stuart R Kerr, Iii

Reeshemah L Beaty

Robert S Dordick

Eric Gaulle

The invention concerns a composition cross-linkable under radiation. The composition includes at least one polyorganosiloxane with cross-linkable functional groups, a stabilizing amino agent, and an initiator system for hardening under radiation. The composition is stable for use and storage.

Stable polyorganosiloxane based compositions with cross-linkable functional groups and their use for producing antiadhesive coating

Functional mixed polyorganosiloxanes, well suited for formulation into curable release compositions, notably for paper, comprise the same or different recurring structural units of the formula (I):

Olefinically functional polyorganosiloxanes and curable silicone

The invention relates to a composition based on crosslinkable epoxy-functional organopolysiloxanes. This composition comprises:

Crosslinkable polyorganosiloxane composition

Stable curable silicone compositions, well suited for the deposition of release coatings onto a wide variety of substrates, for example paper or plastic films, comprise a hydrosilylation-curable polyorganosiloxane oil and/or at least one Si alkenylated organopolysiloxane resin and, optionally, at least one organohydrosiloxane resin, an SiH crosslinking agent therefor, a hydrosilylation-inhibiting amount of a long chain acetylenic alcohol, advantageously having a boiling point higher than 250.degree. C., and a catalytically effective amount of a hydrosilylation catalyst, e.g., platinum or a platinum compound/complex.

Silicone compositions comprising long chain .alpha.-acetylenic alcohol

Unique silicone adhesion modifiers well suited for formulation into curable release compositions containing a linear polydiorganosiloxane, comprise an organopolysiloxane resin (A) containing at least 0.1 mol % of alkenyl or alkenyloxyalkylene radicals directly bonded to silicon atoms, an organopolysiloxane resin (B) containing at least 0.5 mol % of hydrogen atoms directly bonded to silicon atoms, and a solvent/diluent (C) for the resins (A) and (B).

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Lyons, France

Andre Soldat