France Telecom

France Telecom/cnet

Andre Schiltz

Aime Vareille

Jean C Hauuy

Aomar Halimaoui

Joaquim Torres

Jean Palleau

Jean Marc Francou

Louis Thevenot

Marie-Jeanne Bouzid

The present invention relates to an improved photolithography process particularly suitable for high-resolution optical lithography techniques using the g, h and i lines of the spectrum of mercury and short-wavelength UV, comprising, prior to deposition of the photosensitive resin on the layer of material to be lithographically patterned, the formation of an antireflective porous layer within the said layer to be lithographically patterned and on the surface of the latter.

Antireflection treatment of reflective surfaces

A process for mounting of an optical fiber (1) on a substrate (2) and for optical coupling between this fiber and an optical or optoelectronic element (17) or component such as a waveguide, a receiver or an emitter formed or carried on the front face (5) by the substrate, consisting in inserting the end of an optical fiber (1) into a through orifice (6) formed in the substrate (2) engaging it by the rear face of the substrate, in sealing the end of the optical fiber in said orifice, and in forming on the path of the optical wave a deflecting facet (18) such that the optical wave originating from the optical fiber is deflected by this facet towards said element or component (17), or vice versa.

Process for mounting an optical coupling of an optical fiber on a

Optical method for determining the lateral gap of two pieces (1, 2) having adjacent edges (3, 4) forming a slot (5) consisting in emitting a parallel light beam (8) through at least one zone of said slot, from one side of the latter; in detecting the beam (8a) passing through this zone of said slot, at the other side of the latter; and in comparing the light intensity of this beam transversing said zone with a predetermined value so as to obtain or to provide the gap between the edges of said pieces in said zone. This method may be applied to the positioning of a first piece, such as a chip, opposite or in an opening made in a second piece, such as a substrate, and may consist in moving said first piece in order to bring it above the opening of the second piece, in comparing, as the first piece moves, the light intensity passing through the slot separating said pieces and in stopping the movement of the first piece when the intensity of the light through-beam is equal to a predetermined value.

Optical method for determining relative positions of two pieces and

Method for the insertion of chips into housings let into a substrate especially of the hybrid type, consisting, before fixing the chips (1a) into the abovementioned housings (2a), in holding the chips (1a) respectively in the abovementioned housings (2a) by the agency of a film (6) which is bonded to one of the faces of the substrate (3) and to which are bonded the chips.

Method and device for the insertion of chips into housings in a

An optical method and optical device for distance measurement, comprising the steps of emitting an incident light beam (13) comprising at least two waves of differing wavelengths (.lambda.1 and .lambda.2); separating this beam into a reference beam (15) and a measurement beam (17) which are reflected on, respectively, a reference reflector (16) and a zone (18) of a part (19), of which it is desired to measure the position in the direction of the measurement beam and recombine into a resultant beam (20), in which said waves exhibit conditions of polarization, the components of which rotate when the optical path of the aforementioned measurement beam varies and which determine, in the direction of the measurement beam, adjacent ranges at the ends of each one of which the angular positions of two corresponding components of these conditions of polarization are identical; determining, in the resultant beam (20), the angular positions (.alpha.1 and .alpha.2) of two corresponding components of said conditions of polarization of said waves; and computing, as a function of said angular positions, the distance separating the aforementioned zone of said part from a reference position, preferably the image of the reference reflector. Their application to the positioning of parts, especially of a chip inserted in a substrate.

Optical method and optical device for distance measurement and their

A lift-off process for removing a portion of a metal layer (4). The metal layer is formed on a dielectric polymer substrate with interposition of a corresponding portion of an intermediate layer (2). This process comprises the steps of selecting the material of the intermediate layer so that its interface with the metal has a low adhesivity; applying to the structure a mechanical stress causing detachment of the metal at the interface; and chemically removing the intermediate layer.

Mechanical lift-off process of a metal layer on a polymer

An elastomer connector is disclosed for integrated circuits or similar, comprising an elastomer material support on one face of which is formed a dense network of electro-conducting lines. Using photo-etching techniques and metal deposition on a layer of strippable material, which techniques are used for manufacturing integrated circuits, the lines may be given a very small width and very high conductivity.

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Saint Ismier, France

Andre Schiltz