Motorola Corporation

Andre Peyre Lavigne

Philippe Lance

Lionel Lescouzeres

Michael Bairanzade

Jean Paul Guillemet

A method for forming a semiconductor sensor device comprises providing a substrate (4) and forming a sacrificial layer (18) over the substrate. The sacrificial layer (18) is then patterned and etched to leave a portion (19) on the substrate (4). A first isolation layer (6) is formed over the substrate (4) and portion (19) of the sacrificial layer and a conductive layer (12), which provides a heater for the sensor device, is formed over the first isolation layer (6). The portion (19) of the sacrificial layer is then selectively etched to form a cavity (10) between the first isolation layer (6) and the substrate (4), the cavity (10) providing thermal isolation between the heater and the substrate.

Method for forming a semiconductor sensor device

A protected Darlington transistor arrangement comprising: first (2) and second (4) bipolar transistors each having a base, a collector and an emitter, the base of the first transistor being coupled to the base (B) of the Darlington transistor, the collectors of the first and second transistors being coupled to the collector (C) of the Darlington transistor, the emitter of the first transistor being coupled to the base of the second transistor, and the emitter of the second transistor being coupled to the emitter (E) of the Darlington transistor; and a third bipolar transistor (6) having a base, a collector coupled to the collector of the Darlington transistor, and an emitter, wherein the Darlington transistor arrangement further comprises: a Zener diode (8) coupled between the collector of the Darlington transistor and the base of the third transistor, the base of the third transistor being coupled to the emitter of the second transistor, and the emitter of the third transistor being coupled to the base of the second transistor.

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Toulouse, France

Andre Peyre Lavigne