U.S. Philips Corporation

Andre J Linssen

Robert E Van De Grift

Martien Van Der Veen

An integrated semiconductor circuit, in which the D.C. part of the wiring containing only D.C. information lies on a part of the insulating layer located on the surface which is considerably thinner than the parts of the insulating layer under wiring parts not forming part of the D.C. wiring. Preferably, for this purpose a substrate contact diffusion connected to a reference potential is provided under the D.C. wiring parts. As a result, H.F. interference signals on the D.C. wiring are reduced so that noise and distortion are considerably reduced.

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Eindhoven, Netherlands

Andre J Linssen