Robert Boschgmbh

Andre Gerlach

Ando Feyh

Ricardo Ehrenpfordt

Christina Leinenbach

Ulrike Scholz

Mathias Bruendel

Jens Strobel

Sonja Knies

Johannes Henneberg

David Bartylla

Stefan Zimmermann

Felix Streichert

Christopher Brown

Marko Liebler

Christian Zott

Guenter Gerlach

Florian Haug

Steffen Polster

Claudia Arnold

Bernd Scheufele

An acoustic transducer, in particular for an ultrasonic sensor, is proposed. The acoustic transducer has a functional group, the functional group encompassing a diaphragm cup and at least one electroacoustic transducer element. The acoustic transducer furthermore has a housing. The diaphragm cup encompasses a vibration-capable diaphragm and an encircling wall, as well as at least one electroacoustic transducer element, the transducer element being embodied to excite the diaphragm to vibrate and/or to convert vibrations of the diaphragm into electrical signals. The diaphragm cup is constituted from a plastic material, the at least one transducer element being integrated into the vibration-capable diaphragm, the transducer element having an electrically active polymer.

Sound transducer, having a transducer element integrated in a vibration-capable diaphragm including an electrically active polymer

A sound transducer, in particular, for an ultrasonic sensor, includes a functional group, the functional group including a diaphragm cup and at least one electroacoustic transducer element. The sound transducer also includes a housing. The diaphragm cup includes a vibratory diaphragm and a circumferential wall, and at least one electroacoustic transducer element, the transducer element being configured to stimulate the diaphragm to vibrate and/or to convert vibrations of the diaphragm into electrical signals. The diaphragm cup is formed from a plastic material, the at least one transducer element being integrated into the vibratory diaphragm, in particular without an additional adhesive layer, the transducer element including a piezoceramic element.

Sound transducer including a piezoceramic transducer element integrated in a vibratory diaphragm

A sound transducer has a diaphragm cup, a transducer element, and a housing, the diaphragm cup having a diaphragm and a wall. The diaphragm, the wall, and at least one housing part are formed in one piece as a fiber-plastic composite component. At least one first region of the fiber-plastic composite component is reinforced with fibers, and at least one second region of the fiber-plastic composite component is free of fibers, so that waves in the fiber-plastic composite component are at least partly reflected at a transition from the at least one first region to the at least one second region.

Sound transducer

A method for electrically contacting a piezoelectric ceramic includes: providing the piezoelectric ceramic having electrodes for electrically contacting the piezoelectric ceramic and having a flexible, electrically conductive film; producing a composite by applying the flexible, electrically conductive film at least partially to an electrode of the piezoelectric ceramic; forming a durable, electrically conductive connection between the flexible, electrically conductive film and the electrode of the piezoelectric ceramic. Also a sound transducer, as well as a sound transducer array produced using the method for electrically contacting a piezoelectric ceramic.

Method for electrically contacting a piezoelectric ceramic

An electroacoustic transducer includes: a housing; an oscillating structure including at least one disk-shaped piezoelectric element having first and second surfaces; an acoustic transmitter; and electrical connecting element contacting electrodes of the piezoelectric element. The acoustic transmitter has parallel first and second surfaces, which first surface is joined to the first surface of the piezoelectric element, and which second surface is suitable for emitting and/or receiving sound waves. The distance between the second surface of the acoustic transmitter and the second surface of the piezoelectric element corresponds to &#xbc; of the resonance oscillation wavelength of the oscillating structure. The piezoelectric element is connected to the housing with the aid of a bearing structure which allows transverse strains of the piezoelectric element.

Electroacoustic transducer

An ultrasonic transducer system includes at least one transducer element, a diaphragm, and at least one resonance body, the ultrasonic transducer system being configured for transmitting and/or receiving ultrasonic signals, the resonance body being coupled at an end face to the diaphragm and the at least one transducer element being coupled to a lateral surface of the resonance body so that the at least one transducer element and the resonance body have a shared interface. Also described is a method for the manufacture and to a motor vehicle having an ultrasonic transducer system of this type, the diaphragm of the ultrasonic transducer system being formed by an outer skin of a bumper, a side mirror, or a door section, and the transducer element(s) and resonance bodies being situated concealed behind the outer skin.

Ultrasonic transducer system and motor vehicle including an ultrasonic system

An electroactive sound transducer foil includes a composite foil made up of at least one carrier foil, at least one first and one second electrode, and at least one piezoelectric layer including an electroactive polymer, the surface of the sound transducer foil including a structuring having different slopes, and the slope of the sound transducer foil surface changing the sign at least twice.

Electroactive sound transducer foil having a structured surface

An electroacoustic transducer is provided that combines the properties and advantages of the known concepts of the thickness mode transducer and of the bending transducer with each other. For this purpose, an electroacoustic transducer is provided, which includes a housing and an oscillating structure. The oscillating structure is formed by at least one piezoelectric element, a diaphragm, and an acoustic transmitter. It is provided that the diaphragm is designed as a bending transducer, and the acoustic transmitter is designed as a thickness mode transducer.

A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate, at least one circuit chip mounted on the substrate, and an enveloping package in which the circuit chip is packaged. The functional apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement having a plurality of micromechanical loudspeakers, which is mounted on the enveloping package. A covering device is mounted above the micromechanical functional arrangement, particularly the loudspeaker arrangement, opposite the enveloping package. A method is implemented to manufacture the micromechanical functional apparatus.

Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture

A system for determining the distance from and the direction to an object includes an emitter and at least two receiver elements for receiving a signal which is transmitted by the emitter and reflected by the object. The receiver elements are arranged as a linear array, as two linear arrays situated at an angle to one another, as an array which surrounds the emitter and forms a circle, or as a two-dimensional array. The diameter of the array may be greater than one-half the wavelength of the signal, and the receiver elements each have an individual surface area whose height or diameter corresponds at most to one-half the wavelength of the signal, and the emitter has a height or a diameter which is greater than one-half the wavelength of the signal.

System for determining the distance from and the direction to an object

A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate having a top and an underside and at least one circuit chip mounted on the underside in a first cavity. The apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement, having a plurality of micromechanical loudspeakers mounted on the top in a second cavity. A covering device is mounted above the micromechanical functional arrangement on the top. An appropriate method is implemented to manufacture the micromechanical functional apparatus.

A piezoelectric sound transducer using a piezoelectric plastic material is developed from a substrate layer and a layer of a piezoelectric plastic material deposited thereon, the piezoelectric plastic layer covering the substrate layer not completely but having openings.

Piezoelectric partial-surface sound transducer

A MEMS chip package includes a first chip, a second chip, a first coupling element, and a first redistribution layer. The first chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The second chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The first coupling element couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip. The first redistribution layer is mounted on the second chip surface of the second chip and is configured to provide contact with a substrate.

Growing community of inventors

Leonberg-Hoefingen, Germany

Andre Gerlach