Checkpoint Systems, Inc.

Omni-id Cayman Limited

Sato Holdings Kabushiki Kaisha

Omni-id Corporation, Inc.

Andre Cote

Eric Alan Eckstein

Detlef Duschek

Thomas J Clare

Luis Francisco Soler Bonnin

Anthony F Piccoli

Paul Richard Clarke

Edmund Siegfried Nabrotzky

Anthony Kington

Gary Thomas Mazoki

Lawrence C Appalucci

Takeshi Matsumoto

Robert H Evans

Hideaki Imaichi

Jack Mingle

Christopher A Jones

David Lopez Perez

Ed Kmet

Kerry Ludden

Detlef Dusckek

Farrokh Abadi

Rolando Roques Martinez

Edmund S Nabrotzky

Thomas Clare

An identification band includes a strip of material including a first elongated strip portion at one end thereof, a second elongated strip portion at an other end thereof, and a transponder supporting portion provided therebetween. A transponder is provided in the transponder supporting portion. The first elongated strip portion is sized and configured to be secured completely around an object to be identified via at least one fastener in the first elongated strip portion, thereby defining a first loop around the object. The second elongated strip portion is sized and configured to be secured via the at least one fastener in the second elongated strip portion. The first elongated strip portion, the transponder supporting portion, and the second elongated strip portion together define a second loop at least partly around the object. An air gap exists between the transponder supporting portion and an outer surface of the first loop.

Identification band

RFID driven display system components such as wireless displays (visual RFID tags) and multi-antenna wireless RFID readers that monitor/control the RFID driven displays in order to provide visual real-time information to display viewers and/or provide useful information to a central processing station that monitors the status of and/or updates the RFID driven displays, networks including one or more of the components, and methods for using the RFID driven display system components to monitor assets in applications such as inventory control and manufacturing.

Visual RFID tags and interactive visual RFID networks

The present invention relates to methods of assembly, labeling and programming decoupled EM tags used in the tagging and tracking of items wherein the tags including a printable label portion and a decoupler portion which are combined after printing on the surface of and programming a programmable device associated with the label portion.

One and two-part printable EM tags

A method for determining billing information for a tag application process for billing a customer using the tag application process, includes the steps of determining a cost component of said tag fabrication process and determining billing information in accordance with said cost component. The customer is billed in accordance with said determined billing information.

Method and system for determining billing information in a tag fabrication process

A combination EAS and UHF security tag that adds the ability to add item level UHF functionality to a retail tag and maintain the integrity of the EAS systems installed in the business and whereby the EAS and UHF security elements are substantially formed from a common conductive layer. This combination tag also includes the ability to change a tag from a 'far-field read' tag to a 'near-field read' tag.

EAS and UHF combination tag

A method for installing an RFID tag on shipping articles includes applying a strip of conductive material to the surface of the article and providing an RFID chip having a body, a first bottom conductive point, a second bottom conductive point and a nonconductive fin between the first bottom conductive point and the second bottom conductive point. The fin is received in the shipping article. The RFID chip is attached to the shipping article by inserting the chip onto the strip of conductive material on the shipping article such that the fin severs the strip into a first strip and a second strip. The first bottom conductive point is electrically attached to the first strip and the second bottom conductive point is electrically attached to the second strip.

RFID tags for pallets and cartons and system for attaching same

A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps or capacitor straps that are releasably secured to a liner using only a low tack adhesive and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process.

Transfer tape strap process

A process for forming a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia includes providing a substrate which constitutes a portion of the package, label or sheet to a printing apparatus, and utilizing the printing apparatus or an adjunct to the printing apparatus to form at least one electrically conductive component of an EAS and/or RFID tag on the substrate substantially contemporaneously with the printing of the indicia on the substrate. The forming of the electrically conductive component on the substrate is accomplished slightly prior to the printing of the indicia on the substrate, slightly after the printing of the indicia on the substrate and at the same time as the printing of the indicia on the substrate.

Process for forming at least a portion of a package or an envelope bearing a printed indicia

A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.

Rotary chip attach process

A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Die attach area cut-on-fly method and apparatus

A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.

Method of fabricating a security tag in an integrated surface processing system

A capacitor strap that is applied to a security tag coil or antenna to form and properly tune an EAS or an RFID security tag. The capacitor strap is a thin film capacitor formed of two metal foils in between which is a dielectric material having ends that are electrically coupled to different points of a security tag coil or antenna. The capacitor strap may include an RFID integrated circuit, either in series or in parallel with the capacitor, which is then applied to security tag coil at a particular location to tune the tag to a predetermined frequency.

Growing community of inventors

Williamstown, NJ, United States of America

Andre Cote