Giesecke & Devrient Gmbh

Giesecke+devrient Mobile Security Gmbh

Ando Welling

Joachim Hoppe

Yahya Haghiri-Tehrani

Thomas Tarantino

Josef Riedl

Matthias Bergmann

Albert Ojster

Peter Huber

Kolja Vogel

Franz Sziljer

Andreas Linke

Juergen Usner

Johann Angerer

A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

Transfer method for manufacturing conductor structures by means of nano-inks

A method for the production of a portable data carrier having an integrated circuit and a contact field galvanically connected to the integrated circuit. In an area defined by the contact field, the portable data carrier is shaped and the contact field is embodied such that a direct contacting of the contact field by a contacting component embodied in accordance with the USB standard is possible. The portable data carrier in its final form is produced in chip card technology. Alternatively, an element is produced in chip card technology, which element features the integrated circuit and the contact filed, and data and/or program code required for the operation of the portable data carrier are loaded into the integrated circuit. Subsequently the element is permanently connected to a carrier.

Method for the production of a portable data support

A portable data carrier () and a method for its production, including an apparatus () for storing and processing data, an antenna () for transmitting energy and information which is connected to the apparatus (), as well as a plastic surrounding the apparatus () and the antenna (), where the plastic of the portable data carrier is transparent or partially transparent and the antenna () has at least one security feature.

Security elements for antennas

A method and apparatus for through-contacting flexible substratesin particular circuit boards, having electrically conductive contact zonespresent on two opposing surfacesof the substrate provides that a cutis produced obliquely to the surfaces of the substrate in the area of the contact zones, and the two substrate areasadjoining the oblique cut are moved past each other until they lock behind each other. Moving them past each other is effected by a ramby the action of compressed airby applying a vacuumor by a driving hookfixed to the cutting tool. The two steps of producing the cut and moving the two substrate areas adjoining the cut past each other are effected in a common processing station, preferably in a single operation.

Method and device for through-hole plating of substrates and printed circuit boards

The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil () for data exchange and for power supply. The coil () is applied to one or more layers () of the card body by printing technology, whereby after production of the printed coil a metal foil () is placed over the coil terminals () and laminated into the card body, thereby producing the connection between the contact areas () of the printed coil and the metal foil ().

Method and semi-product for producing a chip card with a coil

For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.

Throughplating of flexible printed boards

A circuit unit having a circuit unit comprising an insulating substrate () on which a conductive, flat coil () is located. The coil () can consist of a plurality of coil layers () separated by insulating layers (). To inter-connect the individual coil layer section () into a coil, at least one opening () is provided in each of the insulating layers (). The connection between the first coil ends () of the coil () and an integrated circuit () or a module () containing the integrated circuit () can be formed solely by the coil ends () and the connection points () of the integrated circuit () or the contacts () of the module () touching. The individual turns of the coil () can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area () conforming with the standard.

Method for producing a circuit unit

The invention relates to a data carrier (,) having an integrated circuit (,) and at least one insulating supporting substrate (,) on which a transfer element (,) for transferring data to an external device is disposed. The integrated circuit (,) can alternatively be mounted in the data carrier (,) directly or packed in an electronic module (,). For establishing an electric connection between the integrated circuit (,) or electronic module (,) and the transfer element (,), the data carrier (,) has electroconductive surfaces (,) opposite the two main faces of the electronic module (,) or integrated circuit (,). The electroconductive surfaces (,) are connected with the opposing contact surfaces (,) of the electronic module (,) or the contacts (,) of the integrated circuit (,) and connected in pairs with the electroconductive surfaces (,) disposed on the other side of the electronic module (,) or integrated circuit (,). Each pair of electroconductive surfaces (,) is further electrically connected with the transfer element (,). The transfer element (,) can be formed as a printed coil, the coil ends (,) being widened and each forming one of the electroconductive surfaces (,) of each pair.

Data carrier which can be operated without contact

A circuit unit having an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layer sections (9, 17) separated by insulating layers (11). To interconnect the individual coil layer sections (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.

Growing community of inventors

Isen, Germany

Ando Welling