Sciosense B.v.

Ams Ag

Ams International Ag

Technische Universitat Graz

Ams Sensors Asia Pte. Ltd.

Anderson Singulani

Willem Frederik Adrianus Besling

Remco Henricus Wilhelmus Pijnenburg

Olaf Wunnicke

Casper Van Der Avoort

Harald Etschmaier

Markus Rossi

Franz Schrank

Jochen Kraft

Georg Röhrer

Colin Steele

Georg Roehrer

Alexander Bergmann

Martijn Goossens

Jean-Francois Seurin

Frederik Willem Maurits Vanhelmont

Erik Jan Lous

Georg Parteder

Baiming Guo

Alberto Maccioni

Raffaele Coppeta

Verena Vescoli

Cas Van Der Avoort

Paul Maierhofer

Goran Stojanovic

Thomas Fröhlich

Remco Henricus Pijnenburg

Willem Frederik Besling

Frederik Vanhelmont

Fernando Castano

Simon Mueller

Jacopo Brivio

A device comprising: an illumination device for emitting an illumination beam, the illumination device comprising: an emitter array comprising multiple light emitters; and a meta-structure or micro-prism array comprising multiple transmission areas, the meta-structure of micro-prisms being positioned to receive light emitted from the emitter array, in which light from the meta-structure of micro-prism forms the illumination beam, in which a first one of said multiple transmission areas is arranged to emit light in a different direction than a second one of said multiple transmission areas.

Illumination device

A particulate matter sensor system for sensing particulate matter in a fluid includes a substrate and a cover disposed on the substrate. The cover defines at least a portion of a flow path through the microfluidic system. The sensor system includes a particulate matter sensor disposed in an interior space between the cover and the substrate. The particulate matter sensor includes an integrated sensor device electrically connected to the substrate. The flow path is defined through the particulate matter sensor. The sensor system includes a fluid circulation device disposed in the interior space between the cover and the substrate and configured to cause fluid to flow along the flow path through the microfluidic system.

Integrated particulate matter sensor systems

A sensor arrangement and a method of operating a sensor arrangement are disclosed. In an embodiment, a sensor arrangement includes a pressure sensor realized as a capacitive pressure sensor, a capacitance-to-digital converter, a test circuit and a switching circuit coupling the capacitance-to-digital converter and the test circuit to the pressure sensor.

Sensor arrangement and method of operating a sensor arrangement

In an embodiment a system includes a sensor including a base having a base electrode and a first membrane suspended above the base, wherein the first membrane has a first membrane electrode, wherein the first membrane is configured to deflect with respect to the base electrode in response to an environmental condition, and wherein the sensor is configured to measure a capacitance between the base electrode and the first membrane electrode. The system further includes a first device of the system configured to generate electrical interference signals, a first electrically conductive shield layer positioned between the sensor and the first device of the system, wherein the first electrically conductive shield layer defines a plurality of first apertures extending through the first electrically conductive shield layer and a dielectric material disposed in the plurality of first apertures.

Capacitive sensors having temperature stable output

A semiconductor device comprises a semiconductor body and an electrically conductive via which extends through at least a part of the semiconductor body, where the via has a lateral size which is given in a first lateral direction that is perpendicular to a vertical direction given by the main axis of extension of the via and where the via has a top side and a bottom side that faces away from the top side. The semiconductor device further comprises an electrically conductive etch-stop layer arranged at the bottom side of the via in a plane which is parallel to the first lateral direction, and at least one electrically conductive contact layer at the bottom side of the via in a plane which is parallel to the first lateral direction. The lateral extent in the first lateral direction of the etch-stop layer is larger than the lateral size of the via and the lateral extent in the first lateral direction of the contact layer is smaller than the lateral size of the via. Furthermore, the etch-stop layer is arranged between the electrically conductive via and the contact layer in the vertical direction.

Crack-resistant semiconductor devices

A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.

Sensor assembly and arrangement and method for manufacturing a sensor assembly

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Graz, Austria

Anderson Singulani