United Microelectronics Corp.

Anderson Chang

I-Hsiung Huang

Anseime Chen

Chien-Wen Lai

A thermal flow photolithographic process. A thermal flow photoresist is provided. A cross-linking agent is added to the thermal flow photoresist to form a high-temperature cross-linking photoresist material. A substrate having an insulation layer thereon is provided. The high-temperature cross-linking photoresist is deposited over the insulation layer. The cross-linked photoresist layer on the insulation layer is exposed to light, chemically developed and then heated to cause thermal flow.

Growing community of inventors

Miaoli Hsien, Taiwan

Anderson Chang