Siltectra Gmbh

Anas Ajaj

Jan Richter

Christian Beyer

Lukas Lichtensteiger

A method for producing solid layers includes: providing a solid for separating at least one solid layer; fixing an accommodating layer for holding the solid layer on the solid, wherein the accommodating layer has a multiplicity of holes for conducting a liquid, wherein the accommodating layer is fixed on the solid by means of a connecting layer; and thermal loading of the accommodating layer for mechanical generation of stresses in the solid. A crack in the solid propagates along a detachment plane due to the stresses. The solid layer is separated from the solid by means of the crack. The accommodating layer includes at least one polymer material, and the polymer material undergoes a glass transition at a temperature lower than 0&#xb0; C.

Combined wafer production method with a receiving layer having holes

The present invention relates to a method for producing solid body layers. The claimed method comprises at least the following steps: providing a solid body () for separating at least one solid body layer (), arranging a receiving layer () on the solid body for holding the solid body layer (), said receiving layer being made of at least one polymer and an additional material, said receiving layer, in terms of volume, be made mainly of polymer, the additional material having a greater conductivity than the polymer, and the receiving layer () is subjected to thermal stress, in particular, mechanical stress, for generating voltages in the solid body (), wherein a crack in the solid body () along a separation plane () expands due to the voltages, the solid layer () being separated from the solid body () due to the crack.

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Dresden, Germany

Anas Ajaj