Cisco Technology, Inc.

Avago Technologies International Sales Pte. Limited

Anant Thakar

Abhijit Patra

Nagaraj Bagepalli

Prashant Gandhi

Kirti Prabhu

Sagar Borikar

Ayan Banerjee

Ramesh Sivakolundu

Chakradhar Kar

Jayaprakash Balachandran

Joel Richard Goergen

Rakesh Bhatia

Daniel Bernard Hruska

Chad M Jones

Robert Gregory Twiss

D Brice Achkir

Shreyas Shah

Bidyut Kanti Sen

Kameron Rose Hurst

Jeffrey S Earl

Jared B Pendleton

Yun Bai

Ronald Lee Shaffer, Ii

Sean Ceballos-McGee

Phuoc-An N Nguyen

This disclosure describes multiplexed optical transceivers, such as DWDM multiplexer/demultiplexers, which are aggregated in a server chassis to establish a fabric topology interconnecting blade servers to a dedicated switch module. Blade servers installed in the server chassis can utilize not just Ethernet interfaces to connect to network segments, but also PCIe interfaces as well as a combination of Ethernet and PCIe interfaces. The aggregated optical transceivers multiplex and demultiplex wavelength-specific optical signals using a laser source, reducing power consumption over switched fabric ASICs. Servicing of the multiplexed optical transceivers is facilitated by installation and replacement of a laser source. Scaling and redundancy of fabric topology interconnects can be facilitated by selection of laser sources generating expanded ranges of discrete wavelengths. Furthermore, chassis management can be facilitated by configuring network controllers of blade servers to transport chassis management instructions over the fabric topology in-band over a network interface, rather than by an out-of-band pathway.

Aggregation of multiplexed optical transceivers in server chassis to establish fabric topology

A Compute Express Link™ (CXL) over Ethernet (COE) station is provided to bridge a CXL fabric and an Ethernet network to allow for efficient native memory load/store access to remotely connected resources. The COE station supports CXL and Ethernet traffic through its CXL interface, scheduler/packers, decoders, VOQs and VIQs by adding COE tags to Ethernet frames. In CXL controller mode, the CXL controller drives the VOQs. In Ethernet mode, the COE module drives the VOQs, and interacts with the MAC sublayer and the PMA sublayer, which are responsible for encoding and decoding data signals for transmission through a serializer/deserializer.

Compute express Link™ (CXL) over ethernet (COE)

A composite connector includes modular data connectors, electrical power connectors, a fluid exchange connector, an alignment feature, and a housing. The modular data connectors include electrical data connectors and optical data connectors and are configured to carry data. The electrical power connectors are configured to carry electrical power, and the fluid exchange connector is configured to carry cooling fluid. The composite connector includes an alignment feature to align the composite connector with a complementary connector. The housing of the composite connector is configured to contain the modular data connectors, the electrical power connectors, the fluid exchange connector, and the alignment feature in a confined physical space.

Composite connector carrying power, electro-optical data, and fluid input/output

Techniques for sending Compute Express Link (CXL) packets over Ethernet (CXL-E) in a composable data center that may include disaggregated, composable servers. The techniques may include receiving, from a first server device, a request to bind the first server device with a multiple logical device (MLD) appliance. Based at least in part on the request, a first CXL-E connection may be established for the first server device to export a computing resource to the MLD appliance. The techniques may also include receiving, from the MLD appliance, an indication that the computing resource is available, and receiving, from a second server device, a second request for the computing resource. Based at least in part on the second request, a second CXL-E connection may be established for the second server device to consume or otherwise utilize the computing resource of the first server device via the MLD appliance.

Compute express link over ethernet in composable data centers

Unlocking computing resources for decomposable data centers

Embodiments herein describe a computing system which is reconfigurable into different server configurations that have different numbers of sockets. For example, the computing system may include two server nodes which can be configured into either two independent servers (i.e., two 2S servers) or a single server (i.e., one 4S server). In one embodiment, the computing system includes a midplane which is connected to processor buses on the server nodes. When configured as a single server, the midplane connects the processor bus (or buses) on one of the server nodes to the processor bus or buses on the other server node. In this manner, the processors in the two server nodes can be interconnected to function as a single server. In contrast, the connections between the server nodes in the midplane are disabled when the server nodes operate as two independent servers.

Configurable storage server with multiple sockets

In one embodiment, an electric vehicle system includes a power system for charging a battery installed in an electric vehicle and comprising a bi-directional power and data connector for receiving power and data from or transmitting the power and data to an electric vehicle charging device, a communications system comprising a server and configured for receiving power from the power system and receiving data from or transmitting the data to the power system for download or upload at the electric vehicle charging device, and an authentication module for authenticating the electric vehicle charging device. A method is also disclosed herein.

Power distribution and communications for electric vehicle

A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

Closed loop hybrid cooling

In one example, at least one peripheral interconnect switch obtains, from a first endpoint device, a message initiating a direct memory access data transfer between the first endpoint device and a second endpoint device. The message indicates an address assigned to the second endpoint device by a host device as a destination of the message. Based on the address assigned to the second endpoint device by the host device, the at least one peripheral interconnect switch identifies an address assigned to the second endpoint device by the at least one peripheral interconnect switch. In response to identifying the address assigned to the second endpoint device by the at least one peripheral interconnect switch, the at least one peripheral interconnect switch provides the message to the second endpoint device.

Peer direct mechanism for direct memory access across host devices

A high density storage housing includes a housing and a plurality of drive carriers. The housing includes a storage area and a motherboard. The storage area extends across at least a portion of a width and at least a portion of a depth of the housing. The motherboard extends across the storage area and includes a plurality of first connectors. The plurality of drive carriers each include a second connector configured to mate directly with one of the plurality of first connectors. Moreover, the second connector of each drive carrier of the plurality of drive carriers is disposed on a long side of its drive carrier so that the plurality of drive carriers mount storage drives to the housing in a sideways orientation.

Storage drive carrier for high-density storage solution

In some examples, a printed circuit board assembly can include a printed circuit board having four (4) central processor unit (CPU) sockets disposed thereon and sixty four (64) dual in-line memory modules (DIMMs) disposed thereon. The printed circuit board can have a top surface and a bottom surface with two (2) CPU sockets and thirty two (32) DIMMs disposed on the top surface and two (2) CPU sockets and thirty two (32) DIMMs disposed on the bottom surface.

Growing community of inventors

Cupertino, CA, United States of America

Anant Thakar