Intel Corporation

General Electric Company

International Business Machines Corporation

Abb Schweiz Ag

Anandaroop Bhattacharya

Rajiv K Mongia

Peter James Greenwood

Krishnakumar Varadarajan

Subhashish Dasgupta

Sunil Srinivasa Murthy

Michael Ray Bryant

Shyam Ramlal Mathure

Venkateswara Rao Polineni

Chia-Pin Chiu

Mark Angus MacDonald

Sanjeev Balwant Sathe

Himanshu Pokharna

Sridhar V Machiroutu

Varaprasad Venkata Calmidi

Steven Edward Meiners

Subhasish Dasgupta

Sanjay Vijayaraghavan

Rajendra Prasad Vedula

Siddini Venkatesh Prabhu

A current carrying system for use in transporting electrical current between a plurality of electrical devices is provided. The current carrying system includes a busbar having a first axial end, a second axial end, an electrically conductive shaft extending from the first axial end to the second axial end, and at least one cooling feature defined in at least a portion of the electrically conductive shaft. The current carrying system also includes a casing that defines a busbar channel configured to receive the busbar such that the casing at least partially circumscribes the busbar. The current carrying system also includes an air vent defined by the at least one cooling feature and the casing, wherein the air vent is in flow communication with ambient air, and the cooling feature is configured to facilitate a flow of air from the ambient air through the air vent.

Current carrying systems and methods of assembling the same

Electrical equipment that includes a cabinet comprising a plurality of walls is provided. The cabinet is disposed around a plurality of electric components such as conductors. Further, the electrical equipment also includes at least one barrier. The barrier is disposed in the cabinet and spaced apart from the conductor by a spacing distance to define a channel within the cabinet for air to flow between the barrier and the conductor. The barrier is placed such that a portion of the barrier is coupled to one of the plurality of walls of the electric cabinets.

Electrical equipment and a method of manufacturing

Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may include one or more vortex generators coupled to a heat spreader and positioned in close proximity to an electronic component, and a flow of air to provide for an exchange of thermal energy, where the flow of air is provided by a configuration of the housing, and where the one or more vortex generators may promote turbulence to enhance the exchange of thermal energy of the electronic component. In some embodiments, an air mover may be used to increase the flow of air in the housing. Other embodiments are described.

Method, apparatus and computer system for vortex generator enhanced cooling

A mechanism is described for chimney-based cooling of computer components. A method of embodiments of the invention includes determining heat-emitting components of a computing device. The method further includes coupling a chimney to one or more of the heat-emitting components such that chimney effect of the chimney is used to guide air associated with a component in and out of the chimney.

Chimney-based cooling mechanism for computing devices

Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described.

Method and apparatus for inverted vortex generator for enhanced cooling

Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Electromagnetic interference shielding for device cooling

Embodiments of the present invention include an apparatus, method and system for a thermal management arrangement in a standardized peripheral device.

Thermal management arrangement for standardized peripherals

Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.

Electronic package with thermally-enhanced lid

According to some embodiments, an enhanced heat exchanger may be provided. The enhanced heat exchanger may comprise, for example, a heat transfer portion to receive heat from a heat source and to transfer heat from the heat source, and a remote heat sink adjacent to the heat transfer portion to remove heat from the heat transfer portion. In some embodiments, the remote heat sink may comprise a solid metal portion that extends away from the heat transfer portion, and a porous medium coupled to the solid metal portion. According to some embodiments, the porous medium may extend away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.

Growing community of inventors

Bengaluru, India

Anandaroop Bhattacharya