Applied Materials, Inc.

Other

Microfabrica Inc.

Bloom Energy Corporation

University of Southern California

Sarnoff Corporation

David Sarnoff Research Center, Inc.

Crystal Solar, Inc.

Lamina Ceramics, Inc.

Ananda H Kumar

Shamouil Shamouilian

Adam L Cohen

Michael S Lockard

Kieun Kim

Kadthala Ramaya Narendrnath

Dennis Stanley Grimard

Arnold Kholodenko

Dennis R Smalley

Barry Jay Thaler

Alexander M Veytser

Semyon L Kats

Tad Armstrong

Martin Janousek

Tue H Nguyen

Ashok Narayan Prabhu

You Wang

Dien Nguyen

Gang Zhang

Ezekiel J J Kruglick

Kenneth S Collins

Richard T Chen

Vacit Arat

Ming Ting Wu

Surinder S Bedi

Edwin Charles Weldon

Rulon Joseph Larsen, Iii

Young Kim

Srinivas H Kumar

Wing Lau Cheng

Willa M Larsen

Dan Maydan

Brian C Lue

Uri Frodis

Tirunelveli Subramaniam Ravi

Robert J Steger

Ellen Schwartz Tormey

Timothy S Dyer

Michael G Chafin

Edward J Conlon

Arik Donde

Ashish Asthana

Thomas Peter Azzaro

Jennifer Y Sun

Yan Ye

Douglas A Buchberger, Jr

Shiang-Bau Wang

Hamid Noorbakhsh

Senh Thach

Christopher A Bang

Dan Katz

Xiaoye Zhao

Kang-Lie Chiang

Gerhard M Schneider

Robert B Hagen

Jorge Sotelo Albarran

Michael Robert Rice

Vijay D Parkhe

Tetsuya Ishikawa

Hong Peng Wang

Visweswaren Sivaramakrishnan

Matthias Gottmann

Emad El Batawi

Siamak Salimian

Hyman J Levinstein

Vidyut Gopal

Robert W Wu

Stephen Couse

Kyle Tantiwong

Syed Hasan Askari

Tony Kaushal

Pavel B Lembrikov

Jonathan David Mohn

Yixing Lin

Clifford Stow

Kwok Manus Wong

Bernard Dov Geller

Shun Jackson Wu

Mahmoud Dahimene

Farooq M Quadri

Jeffrey A Thompson

Farahmand E Askarinam

Eric Farahmand E Askarinam

Liang Guo Wang

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

A seal composition includes a first alkaline earth metal oxide, a second alkaline earth metal oxide which is different from the first alkaline earth metal oxide, aluminum oxide, and silica in an amount such that molar percent of silica in the composition is at least five molar percent greater than two times a combined molar percent of the first alkaline earth metal oxide and the second alkaline earth metal oxide. The composition is substantially free of phosphorus oxide. The seal composition forms a glass ceramic seal which includes silica containing glass cores located in a crystalline matrix comprising barium aluminosilicate, and calcium aluminosilicate crystals located in the glass cores.

Seal compositions, methods, and structures for planar solid oxide fuel cells

A composite substrate includes a single crystal silicon layer on a glass or glass ceramic layer on a support layer can be used to form GaN layer without cracks. The glass or glass ceramic layer can have a set point and/or strain point below the deposition temperature of GaN, which can assist in releasing stress in the deposited GaN layer. Additionally, the composite substrate can be exposed to a heated and dry hydrogen ambient to reduce an oxide layer between the silicon layer and the glass or glass ceramic layer, to allow the formation of free standing GaN layer.

Silicon composite substrates

Large grain polysilicon films can be exfoliated on a handle substrate, such as a glass or glass-ceramic substrate. The large grain polysilicon can have high mobility for device formation, and can be used for backplane of a display or a sensor array for x-ray detection.

Structure and method for high performance large-grain-poly silicon backplane for OLED applications

Displays can be fabricated using driver transistors formed with high quality semiconductor channel materials, and switching transistors formed with low quality semiconductor channel materials. The driver transistors can require high forward current to drive emission of the OLED pixels, but might not require very low leakage current. The switching transistors can require low leakage current to allow the pixel capacitor to retain the signal level for accurate OLED device emission, preventing abnormal displays or cross talks.

Silicon-based backplane structures and methods for display applications

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that (1) partially coats the surface of the structure, (2) completely coats the surface of the structure, and/or (3) completely coats the surface of structural material of each layer from which the structure is formed including interlayer regions. These embodiments incorporate both the core material and the shell material into the structure as each layer is formed along with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a material that would be removed with sacrificial material if it were accessible by an etchant during removal of the sacrificial material.

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

Method of electrochemically fabricating multilayer structures having improved interlayer adhesion

Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

Methods of forming three-dimensional structures having reduced stress and/or curvature

A seal composition includes a first alkaline earth metal oxide, a second alkaline earth metal oxide which is different from the first alkaline earth metal oxide, aluminum oxide, and silica in an amount such that molar percent of silica in the composition is at least five molar percent greater than two times a combined molar percent of the first alkaline earth metal oxide and the second alkaline earth metal oxide. The composition is substantially free of boron oxide and phosphorus oxide. The seal composition forms a glass ceramic seal which includes silica containing glass cores located in a crystalline matrix comprising barium aluminosilicate, and calcium aluminosilicate crystals located in the glass cores.

Composite substrates include a single crystal silicon layer disposed on a ceramic layer, including a transparent glass layer. Combination of single crystal devices and non-single crystal devices can be fabricated on a ceramic substrate.

Composite substrates of silicon and ceramic

This document describes the fabrication and use of ceramic stabilizing layer fabricated right on the product silicon wafer to facilitate its use as a substrate for fabrication of gallium nitride films. A ceramic layer is formed and then attached to a single crystal silicon substrate to form a composite silicon substrate that has coefficient of thermal expansion comparable with GaN. The composite silicon substrates prepared by this invention are uniquely suited for use as growth substrates for crack-free gallium nitride films, benefiting from compressive stresses produced by choosing a ceramic having a desired higher coefficient thermal expansion than those of silicon and gallium nitride.

Methods and structures for preparing single crystal silicon wafers for use as substrates for epitaxial growth of crack-free gallium nitride FILMS and devices

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Fremont, CA, United States of America

Ananda H Kumar