Applied Materials, Inc.

General Electric Company

Other

Anand Kumar

Yogananda Sarode Vishwanath

Kenneth S Collins

Andrew Nguyen

Shahid Rauf

Michael D Willwerth

Ajit Balakrishna

Bradley J Howard

Tom K Cho

Tom K Choi

Sirosh Sivasankaran

Yogananda Sarode

Prashant Marikatti

Jikku Philip

Prashant V Javali

In one example, a substrate support assembly having a cooling base that promotes temperature uniformity. In one embodiment, the cooling base has a top plate. The top plate has cooling channels formed therein. The cooling base has a middle plate. The middle plate has a cooling return plenum disposed on a middle layer. A plurality of islands are disposed in the cooling return plenum. The middle plate has a cooling supply plenum disposed below the middle layer. A plurality of cooling inlets are disposed through the islands and couple the cooling supply plenum to the cooling channels. Cooling outlets fluidly couple the cooling channels to the cooling return plenum. The cooling base has a bottom plate. The bottom plate has a cooling inlets fluidly coupled to cooling supply plenum and cooling outlets fluidly coupled to the cooling return plenum.

Cooling base for a substrate support

Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.

Lift pin assembly

A device includes a hybrid puck corresponding to an electrostatic chuck. The hybrid puck includes a backing region and a chucking region disposed on the backing region. The backing region includes a first dielectric material to improve thermal performance of the hybrid puck. The chucking region includes a second dielectric material different from the first dielectric material to improve leakage current stability.

Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability

A device for providing phototherapy. The device has lights that emit irradiance to provide phototherapy. The lights are positionable to emit the irradiance towards a patient. An enclosure is connected to a base and supports the lights. A control module is operatively connected to the lights and controls the irradiance emitted from the lights. A non-transitory memory module is operatively connected to the control module and stores a control program. A plurality of sensors is operatively connected to the control module and are configured to sense a current position of the lights. The control program is configured to receive inputs that include at least the current position of the lights and to provide outputs to the control module based at least in part on the inputs. The control module controls the irradiance emitted from the plurality of lights based at least in part on the outputs.

Autoregulation of irradiance in phototherapy systems

Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.

Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.

Apparatus and methods for reducing particles in semiconductor process chambers

A system includes a dip tube configured to direct a gas toward a sump. The dip tube includes an inner surface and an outer surface. The system also includes a quench ring coupled to the dip tube. The quench ring is configured to provide a quench fluid flow to the sump over both the inner surface and the outer surface of the dip tube.

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Bengaluru, India

Anand Kumar