Intel Corporation

Ana M Yepes

Omer Asaf

Sidharth Dalmia

Menashe Soffer

Debabani Choudhury

Guodong Zhang

Shilpa Talwar

Kameran Azadet

Hosein Nikopour

Bryan K Casper

Ofir Degani

Wook Bong Lee

Ashoke Ravi

Michael Genossar

Claudio Da Silva

Stefano Pellerano

Rotem Banin

Albert Molina

Georgios Yorgos Palaskas

Duncan Kitchin

Igal Kushnir

Oner Orhan

Saku Lahti

Jianfang Olena Zhu

Emanuel Cohen

Gadi Shor

Jayprakash Thakur

Eren Sasoglu

Sayan Lahiri

Arnaud Lucres Amadjikpe

Kunal Datta

Moshe Teplitsky

Run Levinger

Chintan S Thakkar

Eshel Gordon

Erkan Alpman

Bo Qiu

Reese Bowes

Anand S Konanur

Nasser A Kurd

Ehud Reshef

Bryce D Horine

Mikko S Komulainen

Chung-Hao Chen

Ido Ouzieli

Dong-Ho Han

Zhongsheng Wang

Bradley Alan Jackson

Helen Kankan Pan

Miroslav Baryakh

Josef Hagn

Nebil Tanzi

Ron Pongratz

Tawfiq Musah

Baljit Singh

Peter Sagazio

Amit Freiman

Eyal Goldberger

Kevin J Daniel

Shmuel Ravid

Shuhei Yamada

Noam Kogan

Meir Gordon

Resti Montoya Moreno

Naftali Landsberg

Mikko M Lampinen

Avi Tsarfati

Lior Shakedd

Stefano Brenna

Amr M Fahim

Te Yu Kao

Brian A Wilk

Brandon Davis

Pouya Talebbeydokhti

Tomer Levy

Arik Gihon

Raanan Sover

Kaushik Dasgupta

Eran Gerson

Yossi Tsfati

Nir Weisman

Marian K Verhelst

Anandaroop Chakrabarti

Ra'anan Sover

Anat Bazov

Saeid Daneshgar Asl

Shinwon Kang

Nathan G Narevsky

Gregory Chance

Yaniv Michaeli

Gregory W Chance

Brandon R Davis

Manish A Hiranandani

Yevgeni Sabin

John Fallin

Mohamed A Megahed

Vijay Kasturi

Min Keen Tang

Amit Zeevi

Michael Shusterman

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

Wireless communication technology, apparatuses, and methods

A wireless communication device for communicating across a wireless communication channel includes one or more processors configured to determine whether a further device is generating a radio frequency interference at an operating frequency; transmit a request message to the further device requesting the further device vacate the operating frequency based on the determination that the further device is generating radio frequency interference; receive a response message from the further device; and generate an instruction based on the response message.

Methods and devices for dynamically avoiding radio frequency interference

Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.

Package on antenna package

A metal chassis for a mobile device is configured to transmit a signal of a wavelength. A first side of the chassis faces the inside of the mobile device and includes a first aperture that has a dimension that comprises a first subwavelength width of a slot in the chassis. A second side of the chassis faces free space and includes a second aperture that has a dimension that comprises a second subwavelength width of the slot in the chassis. A channel connects the first aperture and the second aperture. The slot has a length dimension and the channel may be centered along the length dimension. The channel is configured to support a transverse electromagnetic mode for propagation of the signal from the first aperture through the channel to the second aperture. As a part of a mobile device the chassis acts as a secondary radiator for the mobile device.

Wi-gig signal radiation via ground plane subwavelength slit

Embodiments may be generally directed to techniques to utilize a protocol adaption layer (PAL) extension based on the bus protocol to enable a wireless transfer of data between a persistent storage device and a remote device and communicate, via a transceiver, the data as radio-frequency (RF) signals between the persistent storage device and the remote device utilizing the PAL extension.

Techniques to provide wireless storage and processing capabilities

Generally, this disclosure provides systems, devices and methods for integration of millimeter wave antennas in platforms with reduced form factors while maintaining or improving antenna gain. An antenna assembly may include a first planar substrate; a ground plane disposed on the first planar substrate; a second planar substrate disposed on the ground plane; and an antenna radiation element disposed on the second planar substrate. The antenna radiation element may be configured to transmit a signal in the millimeter wave frequency region. The assembly may also include a via to provide a conductive path for the signal from a microstrip feed line, beneath the first planar substrate, to the antenna radiation element. The assembly may further include a dielectric layer disposed on the antenna radiation element to provide increased antenna gain under conditions of reduced air gap between the antenna radiation element and a structural element of an enclosing platform.

Integration of millimeter wave antennas in reduced form factor platforms

Techniques and mechanisms for interconnecting circuitry disposed on a transparent substrate. In an embodiment, a multilayer circuit is bonded to the transparent substrate, the multilayer circuit including conductive traces that are variously offset at different respective levels from a side of the transparent substrate. Circuit components, such as packaged or unpackaged integrated circuit devices, are coupled each to respective input and/or output (IO) contacts of the multilayer circuit, where the conductive traces and the IO contacts interconnect the circuit components with each other. In another embodiment, the multilayer circuit is a flexible circuit that is bent to interconnect circuit components which are disposed on opposite respective sides of the transparent substrate.

Device, system and method to interconnect circuit components on a transparent substrate

High capacity external storage drive

Slim external wireless storage drive

A parallel via design is disclosed to improve the impedance match for embedded common mode choke filter designs. Particularly suited to such designs on four-layer printed circuit boards, the parallel via design effectively suppresses the reflection of the differential pair. By connecting the vias in parallel, the inductance of the entire via structure is reduced while its capacitance is simultaneously increased. By properly choosing the number of parallel vias and the spacing between them, the impedance of the parallel vias can be well controlled within the frequency range of interest. Consequently, the impedance match can be improved and the return loss of a four-layer printed circuit board common mode choke filter design is reduced.

Parallel via to improve the impedance match for embedded common mode filter design

Embodiments of a folded meta-inspired antenna for dual-band operation and user equipment for dual-band operation in a wireless network are generally described herein. In some embodiments, the folded meta-inspired antenna may include first and second conductive layers disposed on opposite sides of a substrate to provide a wideband distributed structure comprising a plurality of high-Q resonances resulting from, at least in part, metamaterial-based loading. Conductive material on the first side of the substrate is arranged around a central longitudinal slot coupled with a plurality of perpendicular slots. For dual-band operation, the folded meta-inspired antenna may operate as a folded monopole at a higher frequency band and operate as a slot-type radiator at a lower frequency band. The plurality of resonances may cause the folded meta-inspired antenna to achieve broader bandwidth at both lower and higher frequency bands.

Dual-band folded meta-inspired antenna with user equipment embedded wideband characteristics

Growing community of inventors

Hillsboro, OR, United States of America

Ana M Yepes