Jds Uniphase Corporation

Lumentum Operations LLC

Scanit Technologies, Inc.

Intel Corporation

Apple Inc.

An-Chun Tien

Vincent V Wong

Joel Christopher Kent

Pedro Manautou

James Yonghong Guo

Lucas Morales

Bryed Billerbeck

Jay A Skidmore

Ion Bita

William H Wang

Hengju Cheng

Brian H Kim

Darren S Crews

Lee Xu

Alfred Floyd Renaldo

Clayton Ka Tsun Chan

Kong Weng Lee

Sudirukkuge T Jinasundera

Ranjith Samuel E John

Ferdinand Mendoza

Wei-zen Lo

Jie Fu

An airborne biological particle monitoring device collects particles floating in air. The monitoring device includes a processor, a camera sensor, and a set of approximately monochromatic illumination sources that correspond to a set of spectral curves. The camera sensor captures images of the particles providing a spectral analysis of the particles. The processor analyzes the images to identify the collected particles.

Airborne particle monitoring system with illumination and imaging

An airborne particle collection system includes a monitoring device and a collection media. The monitoring device includes a housing having an air-intake slot, and a motor. The collection media includes an adhesive-coated tape contained within a removable cartridge inserted into the housing. The removable cartridge includes a particle intake zone, proximate to the air-intake slot, and through which the adhesive-coated tape is exposed to capture airborne particles passing through the air-intake slot, and an inspection zone at which the airborne particles captured at the intake zone are transported for optical imaging. The motor moves the airborne particles captured by the adhesive-coated tape from the particle intake zone to the inspection zone.

Airborne particle monitor

Laser lift-off methods are described in which optical flatness is provided on the back side of a temporary substrate using either an optical layer or optical liquid. A laser is directed through the optical layer or optical liquid and a back side of the temporary substrate to decompose a portion of a process layer supported on a front side of the temporary substrate, followed by separation of the process layer and the temporary substrate.

Surface modification process for laser application

An airborne biological particle monitoring device collects particles floating in air. The monitor includes a camera sensor, illumination source, and quantum-dot illumination source. The camera sensor captures a first image of the particles when the collected particles are illuminated by the illumination source. The camera sensor captures a second image of the particles when the collected particles are illuminated by the quantum-dot illumination source. The first and second images are analyzed to identify the collected particles.

Personal airborne particle monitor with quantum dots

The use of one or more angled or curved and diverging light pipes or reflectors placed in a light source's, e.g. diode's, emission path at appropriate distances, angles and divergence, such that a diode's emission spot size is modified and or redirected from the diode's natural emission path to alternative planes at angle to the diode's natural emission path so that a diode emission safe spot size can be achieved on any plane at angle to the original diode natural emission path at minimum distances from the diode's point of emission.

Low profile depth camera

A time of flight camera device comprises an light source for illuminating an environment including an object with light of a first wavelength; an image sensor for measuring time the light has taken to travel from the light source to the object and back; optics for gathering reflected light from the object and imaging the environment onto the image sensor; driver electronics for controlling the light source with a high speed signal at a clock frequency; and a controller for calculating the distance between the object and the illumination unit. To minimize power consumption and resulting heat dissipation requirements, the light source/driver electronics are operated at their resonant frequency. Ideally, the driver electronics includes a reactance adjuster for changing a resonant frequency of the illumination unit and driver electronics system.

Power efficient pulsed laser driver for time of flight cameras

In order to maximize the dynamic range and depth of field for a depth camera used in a time of flight system, the light source is modulated at a plurality of different frequencies, a plurality of different peak optical powers, a plurality of integration subperiods, a plurality of lens foci, aperture and zoom settings during each camera frame time. The different sets of settings effectively create subrange volumes of interest within a larger aggregate volume of interest, each having their own frequency, peak optical power, lens aperture, lens zoom and lens focus products consistent with the distance, object reflectivity, object motion, field of view, etc. requirements of various ranging applications.

High dynamic range and depth of field depth camera

A time-of-flight (TOF) sensor pixel is provided that performs in-pixel subtraction. The TOF sensor pixel includes a photodetector, a capacitor, and circuitry. The photodetector detects light pulses emitted at a clock frequency, after a time of flight, to provide a photocurrent. The capacitor integrates the photocurrent over an integration period, while the circuitry reverses a flow direction of the photocurrent through the capacitor at twice the clock frequency. At the end of the integration period, the capacitor provides a differential photocharge, corresponding to a capacitor voltage. The capacitor voltage is related to the time of flight of the light pulses and may be used to determine a distance to a target.

Time-of-flight (TOF) system, sensor pixel, and method

A reflector is mounted to an outer perimeter of a heat sink holding at least one edge-emitting semiconductor chip, for example a laser diode. The reflector has a shape suitable for gathering light emitted by the laser diodes and redirecting the light in an upward direction away from the heat sink. The reflector can be overmolded onto the heat sink. The reflector can operate by total internal reflection, so that no additional reflector coating step is required. Injection molding of the reflectors onto the heat sink holding the laser diodes enables mass production of powerful yet inexpensive laser light sources.

Semiconductor light source having a reflector

The present invention relates to the packaging of high power laser(s) in a surface mount technology (SMT) configuration at low-cost using wafer-scale processing. A reflective sidewall is used to redirect the output emission from edge-emitting lasers through an optical element (e.g., a diffuser, lens, etc.). A common electrical pad centered inside the package provides p-side connection to multiple laser diodes (i.e. for power scalability). Thick plating (e.g. 75 um to 125 um) with a heat and electrically conductive material, e.g. copper, on a raised bonding area of a substrate provides good heat dissipation and spreading to the substrate layer during operation. The composite CTE of the substrate layer, e.g. AlN, and the heat/electrical conductive plating, e.g. Cu, substantially matches well with the laser substrates, e.g. GaAs-based, without the requirement for an additional submount.

High power surface mount technology package for side emitting laser diode

An optical assembly is disclosed. The optical assembly includes two or more photo devices to transmit and receive optical signals and a pair of parallel gratings to combine optical signals received from the two or more photo devices prior to transmitting the optical signals to an optical fiber and to separate combined optical signals received from the optical fiber into two or more optical signals to be received at the two or more photo devices.

Mechanism to spectrally combine and divide optical I/O

A transceiver is disclosed. The transceiver includes a carrier assembly having active components to transmit and receive optical input/output (I/O); and a connector, coupled to the carrier assembly to couple optical I/O between the active components and a waveguide.

Growing community of inventors

San Jose, CA, United States of America

An-Chun Tien