3m Innovative Properties Company

Amy S Barnes

Catherine A Leatherdale

Todd A Ballen

Andrew John Ouderkirk

Anatoly Z Rosenflanz

D Scott Thompson

Jacqueline C Rolf

Aaron R Beaber

Michael Albert Haase

Terry Lee Smith

Brant Ulrick Kolb

Thomas Edward Wood

Robert L Brott

Kenton D Budd

Zhaohui Yang

Thomas James Miller

Badri Veeraraghavan

Zeba Parkar

Xiaoguang Sun

Nathaniel P Langford

Wayne W Fan

Evan Koon Lun Yuuji Hajime

Richard M Fischer, Jr

Kari Ann McGee

Marc G Simpson

Methods of making ceramic matrix prepregs are described. The methods include exposing a coated tow of ceramic fibers to a ceramic matrix slurry comprising a solvent and ceramic precursor. The coating is at least partially removed and the slurry infuses into the ceramic fibers to form prepreg. Steps to form ceramic matrix composites are also described, including forming the prepreg into a green body, and sintering the ceramic precursor.

Method of making ceramic matrix slurry infused ceramic tows and ceramic matrix composites

Described are catalyst compositions, oxidizable-gas burner systems, methods of oxidizing oxidizable gas, and methods of preparing catalyst compositions and oxidizable-gas burner systems.

Palladium-based catalyst and support systems

Re-emitting semiconductor constructions (RSCs) for use with LEDs, and related devices, systems, and methods are disclosed. A method of fabrication includes providing a semiconductor substrate, forming on a first side of the substrate a semiconductor layer stack, attaching a carrier window to the stack, and removing the substrate after the attaching step. The stack includes an active region adapted to convert light at a first wavelength &#x3bb;to visible light at a second wavelength &#x3bb;, the active region including at least a first potential well. The attaching step is carried out such that the stack is disposed between the substrate and the carrier window, which is transparent to the second wavelength &#x3bb;. The carrier window may also have a lateral dimension greater than that of the stack. The removal step is carried out so as to provide an RSC carrier device that includes the carrier window and the stack.

Re-emitting semiconductor carrier devices for use with LEDs and methods of manufacture

A molding operation produces an extractor array by providing a mold having a plurality of cavities therein, each cavity being adapted to form an extractor suitable for coupling to an LED die; filling the mold with a plurality of glass particles; heating the glass particles above glass transition temperatures thereof so that the particles are reshaped to conform to the cavity shapes; and forming a land layer that extends between the cavities. The land layer maintains the extractors in a fixed spatial relationship with each other for subsequent handling or processing, such as a simultaneous polishing operation or in attaching the extractor array to a corresponding LED array.

Methods of making LED extractor arrays

A chemical composition comprises one or more urethane oligomers of at least two polymerized units selected from the group consisting of fluorine-containing urethane oligomers and long-chain hydrocarbon-containing urethane oligomers, wherein said oligomers comprise the reaction product of (a) one or more polyfunctional isocyanate compounds, (b) one or more polyols, (c) one or more monoalcohols selected from the group consisting of fluorocarbon monoalcohols, optionally substituted long-chain hydrocarbon monoalcohols, and mixtures thereof, (d) one or more silanes, and (e) one or more stabilizers comprising one or more reactive groups.

Stain resistant polyurethane coatings

Disclosed herein is an optical bonding composition that may be used in optical applications. An LED light source that utilizes the composition is also disclosed, as well as a method of making it. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising surface-modified metal oxide nanoparticles in an amorphous silicate network, the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

Optical bonding composition for LED light source

An optical bonding composition and LED light source comprising the composition are disclosed, as well as a method of making the LED light source. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from (RSiO)wherein Ris an organic group and n is an integer of at least 10; the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

An LED extractor has an input surface adapted to optically couple to an emitting surface of an LED die, and is composed of a glass (including a glass-ceramic) material whose refractive index is at least 2, or at least 2.2.

LED extractor composed of high index glass

Growing community of inventors

Saint Paul, MN, United States of America

Amy S Barnes