Micron Technology Incorporated

Amy R Griffin

Xiaopeng Qu

Brent Keeth

Kunal R Parekh

James Brian Johnson

Xiao Li

Eiichi Nakano

Hyunsuk Chun

Maria Pat F Chavarria

Wesley J Orme

Alpha Chavez Labiano

Systems, methods, and apparatus related to sensor data processing for a vehicle to improve operation when sunlight or other bright light enters a sensor of the vehicle. In one approach, adjustable filtering is configured for a sensor of a vehicle. In one example, an optical filter is positioned on the path of light that reaches an image sensor of a camera. For example, the filtering improves ability to stay in adaptive cruise control when driving into direct sunlight at sunset. The optical filters can have controllable properties such as polarization. In one example, a controller of the vehicle is configured to automatically adjust the properties of the optical filter to improve image quality to improve object recognition. In another example, a camera is configured with composite vision that uses sensors in different radiation spectrums (e.g., visible light, and infrared light). The composite vision can provide enhanced vision capability for an autonomous vehicle that is driving in the direction of the sun.

Sunlight processing for autonomous vehicle control

Methods, systems, and devices for repair techniques for coupled host and memory dies are described. For example, to distribute memory access circuitry among multiple semiconductor dies of a stack, a first die may include a set of one or more memory arrays and a first portion of circuitry configured to access the set of memory arrays, and a second die may include a second portion of circuitry configured to access the set of memory arrays. The second portion of the circuitry (e.g., of the second die) may be configured to support various repair techniques for operations with the set of memory arrays, including techniques in response to column failures or serialization failures associated with the first die, or in response to contact or other interconnection failures with or between the first die and the second die, among other techniques that may be differentiated based on an attribution of error conditions.

Repair techniques for coupled memory dies

Methods, systems, and devices for memory with parallel main and test interfaces are described. A memory die may be configured with parallel interfaces that may individually (e.g., separately) support evaluation operations (e.g., before or as part of assembly in a multiple-die stack) or access operations (e.g., after assembly in a multiple die stack). For example, a memory die may include a first set of one or more contacts that support communicating signaling with or via another memory die in a multiple-die stack. The memory die may also include a second set of one or more contacts that support probing for pre-assembly evaluations, which may be electrically isolated from the first set of contacts. By implementing such parallel interfaces, evaluation operations may be performed using the second set of contacts without damaging the first set of contacts, which may improve capabilities for supporting a multiple-die stack in a memory device.

Memory with parallel main and test interfaces

Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

Heat spreaders for use in semiconductor device testing, such as burn-in testing

Systems, methods, and apparatus related to cruise control for a vehicle. In one approach, speed for a first vehicle is controlled in a first mode using data from sensors. The speed is controlled while keeping at least a minimum distance from a second vehicle being followed by the first vehicle. In response to determining that data from the sensors is not usable to control the first vehicle (e.g., the data cannot be used to measure the minimum distance), the first vehicle changes from the first mode to a second mode. In the second mode, the first vehicle maintains a constant speed and/or obtains additional data from sensors and/or computing devices located externally to the first vehicle. In another approach, the additional data can additionally or alternatively be obtained from a mobile device of a passenger of the first vehicle. The additional data is used to maintain a safe minimum distance from the second vehicle.

Dual-mode cruise control

Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes a base portion and a plurality of protrusions extending from the base portion. When the heat spreader is coupled to the burn-in testing board, the protrusions are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrate, a first heat spreader attached to the first semiconductor device, and a second heat spreader attached to the second semiconductor device. The first heat spreader has a plurality of first projections facing a first direction and positioned in a first arrangement, and the second heat spreader has a plurality of second projections facing a second direction and positioned in a second arrangement different than the first arrangement. In some embodiments, the first projections are aligned with a majority of the second projections in a first direction and are offset with a majority of the second projections in a second direction.

Growing community of inventors

Boise, ID, United States of America

Amy R Griffin