Kepler Computing Inc.

Intel Corporation

Amrita Mathuriya

Sasikanth Manipatruni

Rajeev Kumar Dokania

Noriyuki Sato

Tanay Gosavi

Rafael Rios

Ikenna Odinaka

Debo Olaosebikan

Niloy Mukherjee

Ramamoorthy Ramesh

Somilkumar J Rathi

Robert Menezes

Mauricio Manfrini

Pratyush Pandey

Gaurav Thareja

Christopher B Wilkerson

Ian A Young

Ram K Krishnamurthy

Abhishek A Sharma

Raghavan Kumar

Gregory Kengho Chen

Phil Knag

Huseyin Ekin Sumbul

Nabil Imam

Yuan-Sheng Fang

Jason Y Wu

Darshak Doshi

James David Clarkson

Neal Reynolds

Victor W Lee

Gabriel Antonio Paulius Velarde

Mustansir Yunus Mukadam

Debraj Guhabiswas

Fnu Atiquzzaman

Zeying Ren

Abel Fernandez

Jack T Kavalieros

Van H Le

Biswajeet Guha

Dmitri E Nikonov

Uygar E Avci

Nazila Haratipour

Pramod Kolar

Ananda Samajdar

Maria Isabel Perez

Guarav Thareja

Saskikanth Manipatruni

Erik Unterborn

Ahmad Tavakoli

An integration process including an etch stop layer for high density memory and logic applications and methods of fabrication are described. While various examples are described with reference to FeRAM, capacitive structures formed herein can be used for any application where a capacitor is desired. For instance, the capacitive structure can be used for fabricating ferroelectric based or paraelectric based majority gate, minority gate, and/or threshold gate.

Integrating embedded memory with logic interconnects

A method of fabricating a device comprises forming a multi-layer stack above a first substrate, where multi-layer stack includes a non-linear polar material. In at least one embodiment, method further includes forming a first conductive layer on multi-layer stack and annealing multi-layer stack. A transistor is formed above a second substrate. In at least one embodiment, method also includes forming a second conductive layer above electrode structure and bonding first conductive layer with second conductive layer. After bonding, method includes removing at least a portion of first substrate patterning multi-layer stack to form a memory device.

Method of forming capacitors through wafer bonding

A low power adder uses a non-linear polar capacitor to retain charge with fewer transistors than traditional CMOS sequential circuits. The non-linear polar capacitor includes ferroelectric material, paraelectric material, or non-linear dielectric. The adder may include minority gates and/or majority gates. Input signals are received by respective terminals of capacitors having non-linear polar material. The other terminals of these capacitors are coupled to a node where the majority function takes place for the inputs.

Ripple carry adder with ferroelectric or paraelectric wide-input minority or majority gates

A logic gate includes a first capacitor to receive a first input, the first capacitor coupled to a node and a first diode structure coupled to the first input and the node. The logic gate future includes a second capacitor to receive a second input, the second capacitor coupled to the node and a second diode structure coupled to the second input and the node. The logic gate further includes a third capacitor to receive a third input, wherein the third capacitor is coupled to the node and a third diode structure coupled to the third input and the node.

Diode connected non-linear input capacitors based majority gate

Method of integrating a capacitor including a non-linear polar material with a transistor through wafer bonding

A device structure comprises a first conductive interconnect, an electrode structure on the first conductive interconnect, an etch stop layer laterally surrounding the electrode structure; a plurality of memory devices above the electrode structure, where individual ones of the plurality of memory devices comprise a dielectric layer comprising a perovskite material. The device structure further comprises a plate electrode coupled between the plurality of memory devices and the electrode structure, where the plate electrode is in direct contact with a respective lower most conductive layer of the individual ones of the plurality of memory devices. The device structure further includes an insulative hydrogen barrier layer on at least a sidewall of the individual ones of the plurality of memory devices; and a plurality of via electrodes, wherein individual ones of the plurality of via electrodes are on a respective one of the individual ones of the plurality of memory devices.

Gate coupled non-linear polar material based capacitors for memory and logic

A multiplier cell is derived from a 1-bit full adder and an AND gate. The 1-bit full adder is derived from majority and/or minority gates. The majority and/or minority gates include non-linear polar material (e.g., ferroelectric or paraelectric material). A reset mechanism is provided to reset the nodes across the non-linear polar material. The multiplier cell is a hybrid of majority and/or minority gates and complementary metal oxide semiconductor (CMOS) based inverters and/or buffers. The adder uses a non-linear polar capacitor to retain charge with fewer transistors than traditional CMOS sequential circuits. The non-linear polar capacitor includes ferroelectric material, paraelectric material, or non-linear dielectric. Input signals are received by respective terminals of capacitors having non-linear polar material. The other terminals of these capacitors are coupled to a node where the majority function takes place for the inputs.

Non-linear polar material based low power multiplier with transmission-gate based reset mechanism

Asynchronous full-adder circuit is described. The full-adder includes majority and/or minority gates some of which receive two first inputs (A.t, A.f), two second inputs (B.t, B.f), two carry inputs (Cin.t, Cin.f), third acknowledgement input (Cout.e), and fourth acknowledgement input (Sum.e), and generate controls to control gates of transistors, wherein the transistors are coupled to generate two carry outputs (Cout.t, Cout.e), two sum outputs (Sum.t, Sum.e), first acknowledgement output (A.e), second acknowledgement output (B.e), and third acknowledgement output (Cin.e). The majority and/or minority gates comprise CMOS gates or multi-input capacitive circuitries. The multi-input capacitive circuitries include capacitive structures that may comprise linear dielectric, paraelectric dielectric, or ferroelectric dielectric. The capacitors can be planar or non-planar. The capacitors may be stacked vertically to reduce footprint of the asynchronous full-adder circuit. Asynchronous full-adders coupled in series is used to implement a carry-ripple adder.

Asynchronous full-adder with majority or minority gates to generate carry-out true output

A pocket integration for high density memory and logic applications and methods of fabrication are described. While various embodiments are described with reference to FeRAM, capacitive structures formed herein can be used for any application where a capacitor is desired. For example, the capacitive structure can be used for fabricating ferroelectric based or paraelectric based majority gate, minority gate, and/or threshold gate.

Method of fabricating memory devices using pocket integration

Described herein is a read and write scheme to improve memory reliability. In at least one embodiment, one or more circuitries are provided to perform logic 0 write operation in a first phase and logic 1 write operation in a second phase for a plurality of bit-cells controlled by a word-line. In at least one embodiment, an individual bit-cell comprises a transistor having a gate terminal coupled to the word-line; and a capacitor including non-linear polar material, wherein the capacitor has a first terminal coupled to a plate-line and a second terminal coupled to the transistor, wherein a source or drain terminal of the transistor is coupled to a bit-line.

Time decoupled write operations for non-linear polar material based memory

Asynchronous full-adder with majority or minority gates to generate carry-out false output

Asynchronous full-adder with majority or minority gates to generate sum false output

Ferroelectric or paraelectric wide-input minority or majority gate based low power adder

Methods of fabricating planar capacitors on a shared plate electrode

Capacitor devices with shared electrode and methods of fabrication

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Portland, OR, United States of America

Amrita Mathuriya