Rohm & Haas Electronic Materials LLC

Shipley Company LLC

Other

Macdermid Acumen, Inc.

Amrik Singh

Mark A Poole

Andrew J Cobley

Deborah V Hirst

Trevor Pearson

Roshan V Chapaneri

Craig Robinson

Alison Hyslop

George R Allardyce

Terence Clarke

Martin T Goosey

John E Graves

Kevin D Bass

Terrence Clark

David J Wayness

Zatoon Begum

Anthony J Davies

An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.

Electrolytic generation of manganese (III) ions in strong sulfuric acid

Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

Method of electrolessly depositing metal on the walls of through-holes

Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Electroless copper compositions

Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

Electroless copper and redox couples

Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

Formaldehyde free electroless copper compositions

A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.

Combined adhesion promotion and direct metallization process

Process for at least partially dissolving a copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds. When used in the manufacture of a multilayer printed circuit board, the process improves adhesion between board layers, reduces or eliminates localized delamination of a multilayer board that occurs during through-hole drilling, and eliminates or substantially reduces the occurrence of pink ring.

Process for multilayer printed circuit board manufacture

Growing community of inventors

Coventry, United Kingdom

Amrik Singh