Intel Corporation

Amr Elshazly

Johanna M Swan

Adel A Elsherbini

Arun Chandrasekhar

Shawna M Liff

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

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Hillsboro, OR, United States of America

Amr Elshazly