Spin Memory, Inc.

Silicon Storage Technology, Inc.

Integrated Silicon Solution, (cayman) Inc.

Spin Transfer Technologies, Inc.

Crocus Technology Inc.

Amitay Levi

Kuk-Hwan Kim

Dafna Beery

Andrew J Walker

Gian Sharma

Peter P Cuevas

Pavel Klinger

Marcin Gajek

Chih Hsin Wang

Hieu Van Tran

Nhan Do

Alexander Kotov

Dana Lee

Hung Quoc Nguyen

Neal Berger

Xian Liu

Mourad El Baraji

Yuri Tkachev

Viktor Markov

Yaw Wen Hu

James Yingbo Jia

Benjamin S Louie

Bomy A Chen

Geeng-Chuan Chern

Jack Frayer

Chien-Sheng Su

Michail Tzoufras

Kadriye Deniz Bozdag

Eric Ryan

Isao Nojima

Andy Walker

Girish Jagtiani

Chien Sheng Su

Loc Hoang

A method for manufacturing a magnetic random access memory array incudes forming a source region within a surface of a substrate, forming an array of three-dimensional (3D) structures over the substrate, each 3D structure being separated from an adjacent 3D structure by a cavity region, depositing a channel material on a surface of at least one sidewall of each 3D structure, depositing a gate dielectric material over the channel material on the surface of the at least one sidewall of each 3D structure, forming a first isolation region in each cavity region between adjacent 3D structures over the substrate, and forming a first gate region over the first isolation region in each cavity region.

Three dimensional perpendicular magnetic tunnel junction with thin film transistor array

A method for manufacturing an inverter circuit includes providing a semiconductor substrate and forming at least one dielectric trench isolation structure in the semiconductor substrate to divide the semiconductor substrate into first and second regions. A P+ doped portion and an N+ doped portion is formed in each of the first and second regions. Gate structure layers are then deposited over the semiconductor substrate. A first opening is formed in the gate structure layers over the P+ doped portion of a first region and a second opening is formed in the gate structure layers over the N+ doped portion of a second region. A gate dielectric layer is then formed on an inner side of the first and second openings. The surface of the semiconductor substrate in the first and second openings is etched. A semiconductor material is formed in the first and second openings by selective epitaxial growth.

Compact and efficient CMOS inverter

A method for manufacturing a dynamic random access memory device includes providing a semiconductor substrate and forming a highly doped diffusion region in a surface of the semiconductor substrate. A wordline structure is then deposited on the surface of the semiconductor substrate, where the wordline structure includes an electrically conductive gate layer. An opening is further formed in the wordline structure, where the opening is located at a first end of and extending to the highly doped diffusion region. A semiconductor pillar is then formed in the opening by selective epitaxial growth. An end of the semiconductor pillar is then doped and the doped end is connected with a memory element.

DRAM with selective epitaxial cell transistor

A magnetic memory structure that includes a two-terminal resistive memory element electrically connected with a selector structure. The selector structure includes a semiconductor pillar structure formed on a semiconductor substrate. The selector structure is surrounded by a gate dielectric layer, and the semiconductor pillar structure and gate dielectric layer are surrounded by an electrically conductive gate structure. The semiconductor pillar has first and second dimensions in a plane parallel with the surface of the semiconductor substrate that are unequal with one another. The semiconductor pillar structure can have a cross-section parallel with the semiconductor substrate surface that is in the shape of a: rectangle; oval elongated polygon, etc. The length of the longer dimension can be adjusted to provide a desired amount of current though the semiconductor pillar structure to drive the two-terminal resistive memory element.

Selector transistor with continuously variable current drive

A vertical transistor structure having a metal gate wordline. The vertical transistor structure can include an epitaxially grown semiconductor column surrounded by a thin gate dielectric layer. A gate structure can surround the semiconductor column and the gate dielectric layer. The device can include first and second dielectric layers and an electrically conductive metal layer located between the first and second dielectric layers. The electrically conductive metal of the gate structure can be tungsten (W). In addition, a thin layer of Ti or TiN can be formed between the metal gate layer and the first and second dielectric layers and the gate dielectric layer. The metal gate layer can be formed with or without the use of a sacrificial layer.

Selector transistor with metal replacement gate wordline

A three dimensional magnetic random access memory array that includes a sourceline formed on a substrate and a magnetic memory element pillar that includes a plurality of magnetic memory element pillars formed over the substrate. The three dimensional magnetic random access memory array also includes a transistor formed between the magnetic memory element pillar, the transistor being functional to electrically connect the sourceline and magnetic memory element pillar. A plurality of magnetic memory element pillars may be formed over the substrate with a transistor between each memory element pillar to selectively connect or disconnect each of the magnetic memory element pillars. The transistor can include an epitaxial semiconductor structure having a gate dielectric formed at a side of the epitaxial semiconductor and a gate material formed on the gat dielectric such that the gate dielectric material is between the gate material and the semiconductor material.

In accordance with one embodiment, a method includes forming a cleavable donor substrate, the substrate including monocrystalline Si, forming a dielectric layer above the substrate in a film thickness direction, and cleaving the substrate into an upper portion having the dielectric layer and a lower portion. In one embodiment, the cleavable substrate is formed using a sacrificial buffer layer above the substrate in the film thickness direction, and forming a strained Si layer above the sacrificial buffer layer in the film thickness direction, followed by etching away the sacrificial buffer layer to cleave the substrate. In another embodiment, the cleavable substrate is formed by implanting ions into the substrate to a peak implant position located below an upper surface of the substrate, annealing the substrate and dielectric layer in an inert environment to form blisters at the peak implant position, and cleaving the substrate using the blisters.

High density 3D magnetic random access memory (MRAM) cell integration using wafer cut and transfer

A DRAM memory cell and memory cell array incorporating a metal silicide bit line buried within a doped portion of a semiconductor substrate and a vertical semiconductor structure electrically connected with a memory element such as a capacitive memory element. The buried metal silicide layer functions as a bit buried bit line which can provide a bit line voltage to the capacitive memory element via the vertical transistor structure. The buried metal silicide layer can be formed by allotaxy or mesotaxy. The vertical semiconductor structure can be formed by epitaxially growing a semiconductor material on an etched surface of the doped portion of the semiconductor substrate.

DRAM with selective epitaxial transistor and buried bitline

A structure for providing an inverter circuit employing two vertical transistor structures formed on a semiconductor substrate. The vertical semiconductor structures each include a semiconductor pillar structure and a surrounding gate dielectric. A gate structure is formed to at least partially surround the first and second vertical transistor structures. The semiconductor substrate is formed into first and section regions that are separated by a dielectric isolation structure. The first region includes a P+ doped portion and an N+ doped portion, and the second region includes an N+ doped portion and a P+ doped portion. The N+ and P+ doped portions of the first and second regions can be arranged such that the N+ doped portion of the first region is adjacent to the P+ doped portion of the second region, and the P+ doped portion of the first region is adjacent to the N+ doped portion of the second region.

A dynamic random access memory element that includes a vertical semiconductor transistor element formed on a substrate and electrically connected with a memory element such as a capacitive memory element. The memory element is located above the semiconductor substrate such that the vertical transistor is between the memory element and the substrate. The vertical semiconductor transistor is formed on a heavily doped region of the substrate that is separated from other portions of the substrate by a dielectric isolation layer. The heavily doped region of the semiconductor substrate provides electrical connection between the vertical transistor structure and a bit line. The dynamic random access memory element also includes a word line that includes an electrically conductive gate layer that is separated from the semiconductor pillar by a gate dielectric layer.

A transistor structure, according to one embodiment, includes: an epitaxially grown vertical channel, a word line which surrounds a middle portion of the vertical channel, and a p-MTJ sensor coupled to a first end of the vertical channel. The second side of the vertical channel is opposite the first side of the vertical channel along a plane perpendicular to a deposition direction. A magnetic device, according to another embodiment, includes: a plurality of transistor structures, each of the transistor structures comprising: an epitaxially grown vertical channel, a word line which surrounds a middle portion of the vertical channel, and a p-MTJ sensor coupled to a first end of the vertical channel.

Perpendicular magnetic tunnel junction memory cells having vertical channels

A magnetic memory array having an epitaxially grown vertical semiconductor selector connected with a two terminal resistive switching memory element via a bottom electrode such as TaN. An electrically conductive contact such as tungsten (W) or TaN can be included between the vertical semiconductor channel and the TaN bottom electrode. The electrically conductive contact and the TaN bottom electrode can both be formed by a damascene process wherein an opening is formed in an oxide layer and a metal is deposited into the opening. A chemical mechanical polishing process can then be performed to remove portions of the metal that extend out of the opening in the oxide layer over the oxide surface.

Integration of epitaxially grown channel selector with two terminal resistive switching memory element

A magnetic memory array having an epitaxially grown vertical semiconductor selector connected with a memory element via a bottom electrode such as TaN. An electrically conductive contact such as tungsten (W) or TaN can be included between the vertical semiconductor channel and the TaN bottom electrode. The electrically conductive contact and the TaN bottom electrode can both be formed by a damascene process wherein an opening is formed in an oxide layer and a metal is deposited into the opening. A chemical mechanical polishing process can then be performed to remove portions of the metal that extend out of the opening in the oxide layer over the oxide surface.

Integration of epitaxially grown channel selector with MRAM device

According to one embodiment, a method includes forming a first insulative layer above a bottom surface of a groove and along inner sidewalls thereof, forming a source line layer within the groove of the substrate, forming a first dielectric layer on outer sides of a middle portion of the source line layer, forming a buffer layer on outer sides of the first dielectric layer, forming a gate terminal above the source line layer, forming a gate dielectric layer between the source line layer and the gate terminal and on outer sides of the lower portion of the gate terminal, forming a drain terminal including strained Si on outer sides of the first dielectric layer, and forming a relaxed buffer layer on outer sides of the upper portion of the source line layer and outer sides of the drain terminal, with the gate terminal extending beyond the relaxed buffer layer thickness.

Vertically-strained silicon device for use with a perpendicular magnetic tunnel junction (PMTJ)

The various implementations described herein include methods, devices, and systems for performing operations on memory devices. In one aspect, a memory device a magnetic memory component and a current selector component coupled to the magnetic memory component. The current selector component includes a first transistor having a first gate with a corresponding first threshold voltage. The first transistor comprises a charge storage layer configured to selectively store charge so as to adjust a current through the first transistor. The memory device further includes control circuitry configured to determine a bit error rate of the magnetic memory component and adjust a charge stored in the charge storage layer based on the determined bit error rate.

Growing community of inventors

Cupertino, CA, United States of America

Amitay Levi