Cornell University

Wisconsin Alumni Research Foundation

Cornell Research Foundation Inc.

X Development LLC

Geegah LLC

Other

Honeywell International Inc.

Covidien LP

Culvert-iot Corporation

Chorusview, Inc.

Tyco Healthcare Group LP

Amit Lal

Justin C Kuo

Serhan Mehmet Ardanuc

Chung Hoon Lee

Dean Mamoru Kawaguchi

Max G Lagally

Shankar Radhakrishnan

Hui Li

Steven Tin

Edward John Boling

Edward Maurice Farrell

Prasad Panchalan

Alberto Vidal

Ved Gund

Chung-Hoon Lee

Jason T Hoople

Mamdouh Abdelmejeed

Benyamin Davaji

Ramkumar Abhishek

Kwame Amponsah

Thomas Schenkel

Yue Shi

Qing Ji

Arun Persaud

Bradley James Larson

Paul Powell Rugheimer

Farhan Rana

Ravi G Lal

Peter Seidl

Will Waldron

Vinaya Kumar Kadayra Basavarajappa

Rajesh Duggirala

Norimasa Yoshimizu

Ville Kaajakari

Sachin Nadig

June-Ho Hwang

Ernest Aranyi

Russell S Heinrich

Steven J Eickhoff

Philip C Roy

Christopher Kemper Ober

Douglas J Cuny

Jeffrey James Kriz

Harun Solak

Jeff A Ridley

Debdeep Jena

Chris Xu

Ankur Singh

Douglass L Henderson

Grace Huili Xing

Christopher Batten

Peter N Schlegel

Darius A Paduch

Brion Koprowski

Sahil Gupta

James P Blanchard

Shubham Jadhav

Visarute Pinrod

Adarsh Ravi

Abhijit Sathaye

Alexander Ruyack

Yutong Liu

Juneho Hwang

Serhan Ardanuc

Hang Guo

Mvs Chandrasekhar

Bill Lewis

Connie Wu

Po-Cheng Chen

Alex Ruyack

Katherine Camera

Sarvani Piratla

Fabrizio Michelassi

Yuerui Lu

John Ewer

Ayesa Kaur

Alper Bozkurt

Shi Yue

Serhan M Ardanuc

Xi Chen

Phil Roy

Russel Heinrich

An electronic device includes a microelectromechanical system (MEMS) rectifier. The MEMS rectifier includes a mainboard and a sub-board. The mainboard has one or more radiofrequency (RF) inputs configured to receive an RF signal, and a first electrical contact. The sub-board is positioned parallel to the mainboard with a gap in-between, and has a thin film piezoelectric layer, a second electrical contact positioned opposite the first electrical contact, and a ground plane. The sub-board is configured to vibrate as the RF signal is received at the one or more RF inputs, and the thin film piezoelectric layer is configured to generate energy due to the vibration and piezoelectric properties of the thin film piezoelectric layer.

Microelectromechanical systems (MEMS) rectifier and storage element for energy harvesting

An integrated GHz ultrasonic neuro-cognitive system including a chip-cyborg having a network of biological neurons that forms a biological information processor, which can be controlled by electronics, optics, and GHz ultrasonic beams. In one example, the chip-scale microsystem includes a CMOS chip with RF CMOS and piezoelectric thin film transducers that can generate GHz ultrasonic waves, which can be phased to form narrow beams, achieving significant ultrasonic intensity to affect neurons. With a sufficient number of ultrasonic pixels, the focal point of the beam can be narrow enough to focus effect specific section of a neuron to enhance or decrease synaptic weights owing to ultrasonic radiation forces and acoustic streaming.

GHz-THz ultrasonics and optics for neurotechnology devices, methods, and applications

A single-chip solution for multi-modal imaging with every pixel capable of electrostatic, ultrasonic and optical imaging. The device can be configured in as much modality configurations as possible based on the types of the transducers included in the system.

Monolithic, multi-mode, CMOS-compatible imager with active, per-pixel drive and sense circuitry for transducers

An ultrasonic computation apparatus includes first and second ultrasonic transducer arrays arranged on opposing ends thereof, and further comprises first and second ultrasonic propagation regions arranged between the first and second ultrasonic transducer arrays and proximate respective ones of the first and second ultrasonic transducer arrays, and an intermediate computational structure arranged between the first and second ultrasonic propagation regions. Respective first and second input signals applied to respective ones of the first and second ultrasonic transducer arrays cause propagation of corresponding ultrasonic waves through the respective first and second ultrasonic propagation regions towards the intermediate computational structure. The intermediate computational structure is configured to receive the propagating ultrasonic waves from the respective first and second ultrasonic propagation regions and to generate from the received propagating ultrasonic waves an additional signal that is a function of the first and second signals.

Ultrasonic computation hardware for convolutional neural network computing and other computation applications

Disclosed are ferroelectric devices including devices for performing a multiplication of analog input signals and resonators. In one aspect, a ferroelectric nanoelectromechanical device includes a first structural beam, a first input electrode disposed on a first top portion of the first structural beam, and an output electrode. The apparatus further includes a first ferroelectric film disposed on a second top portion of the first input electrode, and a first resistive layer disposed on a third top portion of the first ferroelectric film, wherein a first electrode is positioned at a first end of the first resistive layer and a second electrode is positioned at a second end of the first resistive layer.

Resistive electrodes on ferroelectric devices for linear piezoelectric programming

In one aspect a high frequency ultrasonic microfluidic flow control device is disclosed. The device includes an array of ultrasonic transducers arranged to direct ultrasound to a microfluidic channel. The device further includes one or more driver circuits. Each ultrasonic transducer is associated with one of the one or more driver circuits, and each ultrasonic transducer is driven by a driver signal from the associated driver circuit. The array of ultrasonic transducers and one or more driver circuits are produced in the same semiconductor fabrication process. The device further includes one or more electrical contacts associated with each ultrasonic transducer in the array if ultrasonic transducers, wherein the one or more electrical contacts associated with each ultrasonic transducer applies the driver signal from the associated ultrasonic driver circuit.

Programmable ultrasonic field driven microfluidics

According to some embodiments of the present disclosure, an intelligent tracking system is disclosed. The intelligent tracking system includes one or more passive tracking devices, an exciter, and a tracker. Each passive tracking device includes one or more transceivers and is energized by an electromagnetic frequency. In response to being energized each passive tracking device transmits a short message. The exciter emits the electromagnetic frequency. The tracker receives short messages from the one or more passive tracking devices and confirms the presence of the one or more passive tracking devices in a vicinity of the tracker based on the received messages.

Intelligent tracking system and methods and systems therefor

A temperature insensitive oscillator system. The system includes a substrate having a first surface and an opposing second surface, a CMOS device with one or more CMOS circuits attached to the first surface of the substrate, one or more piezoelectric transducers attached to an outer surface of the CMOS device, a voltage-controlled oscillator generating a RF frequency, which is transmitted as a plurality of short pulses to the one or more piezoelectric transducers, and one or more delays and oscillators using resistor and active components arranged alongside the piezoelectric transducers or on the CMOS device such that the voltage-controlled oscillator has minimal dependence on temperature, and has minimal deviation from a programmed frequency.

CMOS integrated temperature insensitive, stable, and calibrated oscillator

Disclosed are devices, systems and methods for touch, force and/or thermal sensing by an ultrasonic transceiver chip. In some aspects, an ultrasonic transceiver sensor device includes a semiconductor substrate; a CMOS layer attached to the substrate; an array of piezoelectric transducers coupled to the CMOS layer to generate ultrasonic pulses; and a contact layer attached to the substrate on a side opposite the substrate for providing a surface for contact with an object, where an ultrasonic pulse generated by a piezoelectric transducer propagates through the substrate and the contact layer, such that when the object is in contact with the surface of the contact layer, a reflected ultrasonic pulse is produced and propagates through the contact layer and the substrate to be received at the array of piezoelectric transducers, and the CMOS layer receive and process outputs from the piezoelectric transducers produced in response to the received reflected ultrasonic pulses.

Acoustic sensing systems, devices and methods

An energy harvesting tape comprising a plurality of flexible layers. The plurality of flexible layers includes a solar cell layer configured to capture solar energy, a thermoelectric layer configured to capture thermal energy, one or more piezoelectric layers configured to capture mechanical energy; and an electrode layer configured to capture radiofrequency energy and to transmit a radiofrequency signal. The energy harvesting tape also includes one or more processing units on at least one of the plurality of flexible layers. The one or more processing units are configured to use the captured energy from the plurality of flexible layers to transmit the radiofrequency signal. The energy harvesting tape has a length, a width, and a thickness, where the length is greater than the width, and the width is greater than the thickness.

Multimode energy harvesting device

A rotation sensor, including: (i) a substrate having a top surface and an interior bottom surface; (ii) an electrode module positioned on the top surface of the substrate and including a first set of electrodes configured to generate a bulk acoustic wave directly into the substrate, wherein at least a portion of the bulk acoustic wave is transduced into a shear wave upon reflection on the interior bottom surface of the substrate without use of a reflector, and a second set of electrodes configured to detect the shear wave; and (iii) a controller in communication with the first set and second set of electrodes and configured to determine, based on the detected shear wave, an effect of Coriolis force on the sensor.

Shear wave methods, systems, and gyroscope

A device configured for low-energy ultrasonic 2D Fourier transform analysis, comprising: (i) a first layer comprising an array of piezoelectric pixels; (ii) a second layer comprising an array of piezoelectric pixels; (iii) a third layer, positioned between the first and second layers, comprising a bulk ultrasonic transmission medium; wherein the second layer of array of piezoelectric pixels is in the Fourier plane of an input signal of the first layer array of piezoelectric pixels.

Ultrasonic Fourier transform analog computing apparatus, method, and applications

A system, comprising: (i) an interposer layer; (ii) a circuit layer positioned on the interposer layer and comprising a plurality of sonically-enabled pads; and (iii) an interrogator layer positioned on the circuit layer and comprising a plurality of ultrasonic transducers configured to sonically interrogate the circuit layer; wherein the sonically-enabled pads are configured to generate an electrical signal in response to sonic interrogation from the interrogator layer, if the sonically-enabled pad is functional.

Sonic testing method, apparatus and applications

Growing community of inventors

Ithaca, NY, United States of America

Amit Lal