Bio-rad Laboratories, Inc.

Amir Sadri

Nenad M Kircanski

Tal Rosenzweig

Neven Nikolic

Daniel Y Chu

Paul J Patt

Kun Guo

Thanh-Vi Tran

Carl Marlowe

Manja Kircanski

Gabriel Culinco

Alwin Wan

Milija Timotijevic

Zhiliang Xu

Edmond Young

Brian David Wilson

Roger C Tong

Daniel Konstantinou

Nenad Kircanski

A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

Heat pump device and assembly

A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

Thermal management for thermal cyclers using air tubes

A method for efficiently manufacturing and fabricating microfluidic chips, where a base mold is formed to have positive-relief features used to cast an intermediary template chip with negative-relief features having dimensions of a scale in the micron range. The intermediary template chip is used to case a production mold, which is formed of a reinforced epoxy resin that, once hardened into a solid epoxy member, can withstand the structural pressures of a CNC machining system. The production mold can be refined by a CNC machining, where the refined production mold is then used to cast production chips to be used as microfluidic chips.

Epoxy mold making and micromilling for microfluidics

Microscale fluidic devices and components thereof having a fluid retention groove, as well as systems and methods related thereto. The fluid retention groove facilitates uniform bonding of microfluidic device components.

Microscale fluidic devices and components having a fluid retention groove

Systems, including apparatus and methods, for the microfluidic manipulation, dispensing, and/or sorting of particles, such as cells and/or beads.

On-demand particle dispensing system

Systems, including apparatus and methods, for the microfluidic manipulation, dispensing, and/or sorting of particles, such as cells and/or beads. The systems may include a shaped focusing chamber and/or a branched diverting mechanism.

Multidimensional hydrodynamic focusing chamber

Rapid and uniform temperature changes in the wells of a microplate or any thin-walled plate that contains an array of reaction wells or sample receptacles are achieved by the use of heating and cooling elements with a vapor chamber interposed between such elements and the microplate. The upper surface of the vapor chamber and the underside of the sample plate in certain embodiments are complementary in shape, i.e., they have identical but oppositely directed contours in the areas around each of the sample receptacles, to provide continuous surface contact along the surface of each receptacle. In other embodiments, an intermediary plate is placed between the vapor chamber and the well plate, with the top surface of the intermediary plate being complementary in shape to the underside of the well plate.

Thermal cycler with vapor chamber for rapid temperature changes

A system for controlling an ultrasonic transducer utilizes an indication of the relative phase of the voltage on the transducer and the current passing through the transducer to control the relative phase to a value that has been preselected to correspond to resonance of an electromechanical system that includes the ultrasonic transducer. In one example application, the system includes a waveform generator that produces an oscillating signal, and the frequency of the oscillating signal is adjustable under control of the control processor. The control processor adjusts the frequency of the oscillating signal according to a proportional control law at least some of the time, and according to a proportional-integral control law at least some of the time. The control processor may also control the amplitude of the oscillation of the ultrasonic transducer.

System and method for ultrasonic transducer control

Methods and apparatus for precise positioning of an object using linear actuators based on linear stepper motors operating in microstepping or full step mode, a control algorithm based on compensation table, and a calibration apparatus for obtaining the compensation table.

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Toronto, Canada

Amir Sadri