Compass Electro Optical Systems Ltd.

Dustphotonics Ltd.

Other

Bionaut Labs Ltd.

Amir Geron

Jacob Hasharoni

Moti Cabessa

Gideon Katz

Michael Mesh

Adaya Terem

Alexander Sromin

Nadav Cohen

Eran Oren

Alex Kiselyov

Michael Shpigelmacher

Idan Chayun

Yoel Chetrit

Ben Rubovitch

Mordechai Cabessa

Eli Van Cleve

Yosef Paltiel

John Caputo

Victor Bigio

Dennis Seely

Yehoshua Benjamin

Jeffry Levy

This invention relates to apparatus for creating a magnetic field to propel a magnetic device within a diverse media including biological matrices, tissues, organs, animals and humans. In one embodiment, a cylindrical dual Halbach array provides a uniform magnetic field with a settable field direction. Another embodiment provides support and orientation apparatus for a controlled-gradient conical magnet to achieve a full 4π steradian solid angle coverage around the specimen.

Magnetic propulsion system for magnetic devices

The disclosure describes a method for assembling an optical coupler, the method may include (a) inserting optical fibers of an array of optical fibers through an array of openings of a mount of the optical coupler so that tips of the optical fibers pass through the array of openings of the mount and reach an adaptor; wherein the array of openings of the mount exhibit a first positioning accuracy; (b) using the adaptor to position the tips of the optical fibers at predefined locations, at a second positioning accuracy that is higher than the first positioning accuracy; (c) fixing the tips of the optical fibers to the mount while maintaining the tips of the optical fibers at the predefined locations; and (d) detaching the mount from the adaptor.

Optical coupler and a method for assembling an optical coupler

A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axis related to the second lens array passes through the point of intersection.

Optical coupler and optical fiber passive alignment

Device and method for heat dissipation

A method for assembling an optical interconnect apparatus is provided. The optical interconnect comprises an integrated circuit chip, and at least one optoelectronic chip positioned on the integrated circuit chip, each of the at least one optoelectronic chip including a 2-dimensional optoelectronic array. The optical interconnect further comprises a first and a second microlens array, a bundle of optical fibers coupled to each second microlens array and supported by a bundle housing, and a block structure supporting the bundle housing to a printed circuit board (PCB).

Parallel optical interconnect

A fiber optic bundle including a coupler and a large matrix of fibers assembled from optical ribbons positioned very accurately in the coupler. Preferably, the coupler includes at least two plates, most preferably silicon plates, with a plurality of fiber receiving guides etched therethrough.

Fiber bundle

Systems and methods are provided for controlling optical connectors. A float mechanism for controlling an optical connector can include a pin, a first and a second shaft assembly, and a base. The base can include a first and a second cantilever, and a housing, that defines an opening for receiving the pin. The base can receive the two shaft assemblies. The float mechanism can further include a tab with multiple surfaces and be configured to receive the pin.

Systems and methods for providing controlled independent float mechanisms for optical connectors

An optoelectronic chip assembly including a printed circuit board (PCB) coupled to a substrate, an aperture formed through the printed circuit board and through the substrate, a heat sink, an array of active electro-optical elements mounted in the aperture and connected to a driving chip controlled by the PCB, wherein the driving chip is coupled to the heat sink. Preferably, the assembly further includes a plurality of passive optical elements disposed for optical communication and data transfer with said active electro-optical elements, but thermally isolated therefrom.

Electro-optical chip assembly

Growing community of inventors

Modiin, Israel

Amir Geron