Anokiwave, Inc.

Amir Esmaili

Nitin Jain

Vipul Jain

Noyan Kinayman

David W Corman

Kristian N Madsen

Shamsun Nahar

Chad Cookinham

Guarav Menon

Illustrative embodiments significantly improve RF isolation in a packaged integrated circuit by separating the pins/pads associated with multiple RF channels from one another and also from pins/pads associated with digital circuits. Specifically, in certain exemplary embodiments, the integrated circuit is configured with the pins/pad for the digital circuits on a first edge of the chip, the pins/pads for common RF signals on a second edge of the chip opposite the first edge, and the pins/pads for the individual RF channels on third and fourth edges of the chip. The pins/pads associated with each RF channel may include multiple pins/pads (an 'RF group') and may have a central RF pin/pad with a ground pin/pad on each side of the central RF pin/pad. One or more ground pins/pads may be placed between adjacent RF groups on a given edge of the chip.

Apparatus and method for RF isolation in a packaged integrated circuit

A packaged IC has a package with a die paddle, a signal lead, and a ground lead. The packaged IC also has a die, secured to the package, with a ground pad and a signal pad. The signal pad is electrically connected to the signal lead, and the ground pad is electrically connected to both the die paddle and the ground lead.

Method and apparatus for mitigating parasitic coupling in a packaged integrated circuit

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San Diego, CA, United States of America

Amir Esmaili