Cree Gmbh

Amber Christine Salter

John Adam Edmond

James Ibbetson

Bernd P Keller

David T Emerson

Michael John Bergmann

Kevin Haberern

Ashay Chitnis

Peter Scott Andrews

David Beardsley Slater, Jr

Christopher P Hussell

Eric J Tarsa

Jesse Colin Reiherzer

Theodore D Lowes

Brian Thomas Collins

David Todd Emerson

Michael John O'loughlin

An SMD includes a substrate and one or more electrical contacts on a first surface of the substrate. Each one of the electrical contacts are configured to couple to a corresponding electrical contact located on a surface of a carrier, and are located within a concentric area of the first surface that is less than about 50% of a total area of the first surface. By providing the electrical contacts within the concentric area, the mechanical stress experienced by the electrical contacts can be significantly reduced when compared to conventional SMDs including electrical contacts on the outer edges thereof. Accordingly, the failure rate of the SMD due to separation of one or more of the electrical contacts from the carrier may be reduced.

Surface mount device with stress mitigation measures

A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having square dimensions greater than 3.5 mm used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.

LED package with increased feature sizes

LED chip

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Durham, NC, United States of America

Amber Christine Salter