Apple Inc.

Other

Amaury J Heresztyn

Frank Faqiu Liang

Nagarajan Kalyanasundaram

Keith Alan Cox

Brett W Degner

Peteris K Augenbergs

John Meron Ananny

Ihtesham H Chowdhury

Gordon C Cameron

Brandon B Tulloch

John Danby

Dinesh C Mathew

Eric Steven Jol

Jeffrey J Terlizzi

Albert John Golko

Derek William Wright

Thomas W Wilson, Jr

Todd K Moyer

Jeffrey M Alves

Steven G Herbst

Jim C Hwang

Robert S Parnell

Lian Zhang

Richard Hung Minh Dinh

Jeremy C Franklin

Benjamin M Rappoport

Gaurav Kapoor

Jesse T Dybenko

Jay S Nigen

Stephen Theodore Schooley

Connor Raymond Duke

Derek J Dicarlo

Thomas W Wilson

Henry H Lam

Electronic devices and accessory devices designed for communication with electronic devices are disclosed. An accessory device suitable for use with an electronic device can receive the electronic device. Subject to authentication, the electronic device can read information stored on the accessory device through respective wireless communication circuitry of the electronic device and the accessory device. For example, the accessory device can store information related to the material makeup of the accessory device, dimensional information of the accessory device, and other integrated features. This information can be read and received by the electronic device. As a result, the electronic device can adjust a control system (that regulates thermal energy generation) by increasing a set point temperature that allows one or more processors to operate in a manner consistent with additional thermal energy generation. However, the accessory device protects the user from exposure to the additional thermal energy, thereby preventing injury.

Accessory devices that communicate with electronic devices

Various techniques for temperature management during inductive energy transfer are disclosed. A transmitter device and/or a receiver device can be turned off during energy transfer based on the temperature of the transmitter device and/or of the receiver device.

Temperature management in a wireless energy transfer system

An electronic device may have electrical components that produce heat during operation. An electronic device may also be heated by sunlight incident on the device. A thermal management model may take into account device structures such as housing materials in modeling the thermal behavior of the device. Temperature sensors in the device may be used to measure internal temperatures. The model may use temperature measurements and other data such as environmental data measured with sensors in predicting temperatures for one or more regions in a device. In response to prediction of a temperature greater than a predetermined threshold, the device may take remedial action to avoid overheating. Remedial action may include adjusting electrical components so that they produce less heat, activating a heat blocking component such as an electronic shutter, and reducing communications activity levels and other software activity levels.

Electronic device with thermal management system

In various embodiments, an electronic band for a wearable device having: a first band segment including a first affixing structure configured to couple the first band segment to the wearable device when inserted into a first channel of the wearable device, a processing unit, and a first electrical connector having a plurality of contact pins at least some of which are electrically connected to the processing unit; where the first electrical connector electrically connects the processing unit of the first band segment to a second electronic component positioned within the wearable device when the first affixing structure is inserted into the first channel.

Portable electronic device connector

In various embodiments, an affixing structure of a connector is configured to attach to an affixing structure interface of a portable electronic device that is configured to also couple to an attachment member. A connector plug including conductors coupled to an electrical conduit is coupled to the affixing structure. The conductors are configured to electrically connect to one or more electric components of the portable electronic device and the electrical conduit is configured to electrically connect to one or more diagnostic devices. In some embodiments, an attachment member may include one or more electronic components and spring pins or other conductors connectible to a wearable device. The attachment member additionally includes a connector operable to connect the wearable device to another electronic device.

In various embodiments, an affixing structure of a connector is configured to attach to an affixing structure interface of a portable electronic device that is configured to also couple to an attachment member. A connector plug including conductors coupled to an electrical conduit is coupled to the affixing structure. The conductors are configured to electrically connect to one or more electric components of the portable electronic device and the electrical conduit is configured to electrically connect to one or more diagnostic devices. In some embodiments, an attachment member may include one or more electronic components and spring pins or other conductors connectable to a wearable device. The attachment member additionally includes a connector operable to connect the wearable device to another electronic device.

An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

Heat transfer structure

The described embodiments relate generally to thermal management and more particularly to a method and apparatus for providing thermal insulation from relatively small heat sources in small form factor electronic devices. An insulator layer can be placed between a small heat source and an exterior surface of the device, such as a cover glass layer. In one embodiment, a graphite layer can also be included between the cover glass layer and the insulator layer to spread any transmitted heat across the cover glass layer.

Thermal blocker for mobile device skin hot spot management

A portable electronic device including a temperature sensor embedded in a die is provided. To process temperature measurements the portable electronic device includes a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor when an integrated circuit in the die is inactive. Furthermore, a memory circuit coupled to the processor circuit and the temperature sensor stores a temperature gradient provided by the temperature sensor. A Printed Circuit Board for use in a portable electronic device as above is also provided. A method for performing thermal control in a portable electronic device as above is also provided.

System and methods for thermal control using sensors on die

A polymer dispersed liquid crystal layer applied to the display screen for an electronic device is described herein. The polymer dispersed liquid crystal applied to the display screen is operable to switch between a transparent state and a translucent and/or opaque state. In the transparent state the display screen is viewable as usual. In the translucent and/or opaque state the liquid crystal prevents incident solar radiation from heating up the internal components of the device.

Liquid crystal switching barrier thermal control

A flat-panel display (such as a liquid crystal display) includes one or more features that reduce temperature changes in an array of light valves disposed on a substrate. In particular, heat generated in a light source and/or electronics is conducted away from the light values. For example, a light-source holder, which contains the light source, may include holes that increase the thermal resistance between the light source and the substrate. Alternatively, the light-source holder may include a material having a thermal conductivity that is higher than that of stainless steel. In addition, the flat-panel display may include materials and/or a geometry that increases the thermal resistance along a direction in a plane of the substrate. By reducing temperature changes in the flat-panel display, these features can reduce or eliminate color changes and other visual artifacts that can degrade the quality of displayed images.

Thermal mitigation of flat-panel displays

A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.

Heat removal in compact computing systems

A predefined mathematical relationship that is stored in the memory of a computing system is accessed, wherein the relationship refers to temperatures of a number of points in the system, wherein the points together define a zone. The mathematical relationship yields a representative temperature for the zone. Temperature data from sensors in the system is obtained and applied to thermal models, to estimate the temperatures of at least some of the points that define the zone. The representative temperature for the zone is computed using the estimated temperatures as input to the mathematical relationship. A decision is then made on whether or not to change a power consuming activity limit in the system, based on the computed representative temperature. Other embodiments are also described and claimed.

Thermal zone monitoring in an electronic device

A method and apparatus to improve air flow in an air circulating fan assembly by forming an inlet opening in a fan assembly. A static air pressure profile is calculated along a top portion of the fan assembly configured to operate in an enclosure. The shape of a section of the inlet opening in the top portion of the fan assembly is changed based on a pressure contour of the calculated static air pressure profile. The method is repeated iteratively one or more times using an inlet opening changed by a previously calculated static air pressure profile when calculating a subsequent static air pressure profile. The inlet opening is positioned in the top surface of the fan assembly so that the centroid of the inlet opening is laterally offset with respect to the rotational axis of an impeller in the fan assembly.

Growing community of inventors

Cupertino, CA, United States of America

Amaury J Heresztyn