Nvidia Corporation

Amanulla Khan

Punit Kishore

Kelly Yang

Himakiran Kodihalli

Thenappan Nachiappan

Lianrui Zhang

Sreekar Sreesailam

Testing packaged integrated circuit (IC) devices is difficult and time consuming. When multiple devices (dies) are packaged to produce a SiP (system in package) the devices should be tested for defects that may be introduced during the packaging process. With limited access to the inputs and outputs of the devices, test times increase compared with testing the devices before they are packaged. A CoWoS (chip on wafer on substrate) SiP includes a logic device and a memory device and has interfaces between the logic device and memory device that cannot be directly accessed at a package ball. Test programs are concurrently executed by the logic device and the memory device to reduce testing time. Each memory device includes a BIST (built-in self-test) module that is initialized and executes the memory test program while the one or more modules within the logic device are tested.

Concurrent testing of a logic device and a memory device within a system package

A method includes reading, through a processor of a computing device communicatively coupled to a memory, a design of an electronic circuit at a first level higher than a second level at which design verification and/or design simulation of the electronic circuit is to be conducted, and representing instances of elements of the electronic circuit in a data structure. The method also includes parsing, at the first level, the design to automatically generate a list of regular expressions related to text-matching strings with the elements of the electronic circuit based on removing undesired instances related to the elements from the data structure, and pruning, at the second level, connectivity descriptors of the electronic circuit based on the automatically generated list of regular expressions. Further, the method includes optimizing the design verification and/or the design simulation at the second level based on the pruned connectivity descriptors thereof.

Optimized simulation technique for design verification of an electronic circuit

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Bengaluru, India

Amanulla Khan