Fujitsu Corporation

Amane Inoue

Hideaki Suzuki

Eiichi Nagai

Kouichi Noro

Tohru Takeshima

Masaji Inami

Shingo Hagiwara

On a semiconductor wafer, there are formed chip areas for storing memory areas, scribe areas for cutting the semiconductor wafer, pads for supplying electric signals from the outside in order to write data into the memory areas, and lead wires for electrically connecting the pads with the memory areas. The pads are formed within the scribe areas. After data has been written into the memory areas through the pads, the semiconductor wafer is cut along the scribe areas, thereby obtaining semiconductor chips. At the time of this cutting, the pads or the lead wires are cut.

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Kanagawa, Japan

Amane Inoue