Texas Instruments Corporation

Alvin Lopez Andaya

Rafael Jose Lizares Guevara

Ray Fredric Solis De Asis

Sylvester Tigno Sanchez

Aniceto Tabangcura Rabilas, Jr

Jerry Gomez Cayabyab

Jeniffer Otero Aspuria

Julian Carlo Concepc Barbadillo

In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.

Textured bond pads

A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.

Dicing a wafer

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Calasiao, Philippines

Alvin Lopez Andaya