Qualcomm Incorporated

Alvin Loke

Thomas Clark Bryan

Luverne Ray Peterson

Sreeker Dundigal

Stephen Knol

Kenneth Dubowski

A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.

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San Diego, CA, United States of America

Alvin Loke