Lenovo (Singapore) Pte. Ltd.

Alvin G Davis

Paul Andrew Wormsbecher

William Mark Megarity

April E Ruggles

Christopher J Hardee

Vinod Kamath

Timothy Andreas Meserth

Brian Alan Trumbo

Jeffrey Scott Holland

David John Jensen

Glenn Edward Myrto

James Scott Womble

Diane S Busch

Jean Jidong Xu

Mark S Bohannon

Jim Drake

Leo H Webster

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same

An apparatus includes a fan having a fan housing with guidance members extending from opposing sides of the housing, wherein the fan housing has a depth that is less than a height and width. A handle is pivotably coupled to the fan housing, and guidance tracks are positioned on opposing sides of an open channel. Each of the guidance tracks has a first track portion extending from a first face of a chassis in a first direction into the chassis and a second track portion extending from the first track portion in a second direction. The guidance members move along the corresponding guidance tracks, wherein the fan housing moves along the first track portion in a sideways orientation and reaches an operating orientation in the second track portion.

Cooling fan assembly and guidance track for installing and removing a cooling fan

A computer program product includes a computer readable storage medium having program instructions embodied therewith and executable by a processor to cause the processor to perform a method. The method includes a three-dimensional printer printing a first layer of an object onto a surface that is not part of the three-dimensional printer, wherein the first layer is printed while a printing platform of the three dimensional printer is in a first position. The printer is autonomously repositioned in a second position elevated above the first position by being supported either on the three-dimensional object itself or on a scaffold printed separate from the object. The printer prints a second layer of the three-dimensional object onto the first layer of the three-dimensional object while the printing platform is in the second position. The printer may have a plurality of legs for controllably repositioning the printing platform.

Three-dimensional printer having an expandable envelope

A server chassis, including: a first compartment configured to receive one or more central electronics complexes ('CECs'); and a second compartment configured to receive one or more fans for cooling the one or more CECs, wherein the second compartment is coupled to the first compartment such that: the second compartment is inserted within the first compartment when the second compartment is in an operational position; and the second compartment is outside of the first compartment and rotated relative to the first compartment when the second compartment is in a service position.

Central electronics complex ('CEC') and fan structure

One embodiment of the present invention provides a method of three-dimensional printing. The method includes a three-dimensional printer printing a first layer of an object onto a surface that is not part of the three-dimensional printer, wherein the first layer is printed while a printing platform of the three dimensional printer is in a first position. The printer is autonomously repositioned in a second position elevated above the first position by being supported either on the three-dimensional object itself or on a scaffold printed separate from the object. The printer prints a second layer of the three-dimensional object onto the first layer of the three-dimensional object while the printing platform is in the second position. The printer may have a plurality of legs for controllably repositioning the printing platform.

A heatsink includes a rigid plate and a plurality of pin fins. The plate has a two dimensional array of holes through the rigid plate from a first face to a second face. Each pin fin is received in one of the holes and has a proximal end extending beyond the first face of the plate for conductively receiving heat, a distal end extending beyond the second face of the plate for convective heat exchange with air, a biasing member biasing the pin fin in a proximal direction, and a shoulder limiting the proximal extension of the pin fin through the hole. An apparatus may include the pin fin heatsink secured to a printed circuit board having at least two components that have different heights. Accordingly, each component is contacted by the proximal end of one or more self-adjusting pin fins that are aligned with the component.

Multi-component heatsink with self-adjusting pin fins

In an approach to analyzing audible alerts, one or more computer processors receive an audible alert originating external to a user. The one or more computer processors retrieve data related to the audible alert. The one or more computer processors analyze the data related to the audible alert. The one or more computer processors determine, based, at least in part, on the data related to the audible alert, a cause of the audible alert.

Growing community of inventors

Durham, NC, United States of America

Alvin G Davis