Electrochemicals, Inc.

Surmodics, Inc.

Omg Electronic Chemicals, Inc.

Alvin A Kucera

Roger Bernards

Benjamin Todd Carroll

Joseph Stanton Bowers, Jr

Ralph A Chappa

Michael Militello

Aspects herein relate to apparatus and methods for coating medical devices. In an embodiment, a coating system is included having a two-part fluid applicator defining a central channel, the two-part fluid applicator can include a first part having a first degree of flexibility; and a second part having a second degree of flexibility. The system can further include a fluid supply conduit in fluid communication with the fluid applicator; and a fluid supply reservoir in fluid communication with the fluid supply conduit. Other embodiments are also included herein.

Apparatus and methods for coating medical devices

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

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Maple Grove, MN, United States of America

Alvin A Kucera