Texas Instruments Corporation

Alton D Carpenter

Daniel A Baudouin

James S Wallace

Howard W Segler

An electronic circuit card has a metal case including top and bottom surfaces connected by first and second sidewalls and a rear wall. The case has an interior chamber and an opening at one end. A substrate is positioned in the interior chamber and a connector attached to the substrate and case so as to cover the opening. A metal spring is attached to the substrate in contact with a ground conductor on the substrate. The spring contacts the top and bottom surfaces of the case to support the substrate and to couple the case to the ground conductor. The case provides protection from electrostatic discharge and radio frequency interference and is capable of receiving substrates having different sizes or shapes or different arrangements of mounted electronic components.

Electronic circuit card

The invention provides an apparatus (10) for encasing a printed wiring board (12). Apparatus (10) comprises a substantially tubular housing (14) having internal ribs (30) formed along first and second sides (32) and (34) of housing (14). Printed wiring board (12) is received in housing (14) and maintained in place by ribs (30). An end cap (18) having an aligning member (36) is placed in a first opening (22) of housing (14). A coupling member (20) comprising a connector (40) and a support shell (42) is inserted into a second opening (28) of housing (14).

Method for encasing a printed wiring board

An integrated circuit card includes packaged semiconductor devices mounted on a substrate. The integrated circuit card also includes a housing bonded by sheet adhesives to the semiconductor devices or substrate. The housing includes top and bottom metal covers and may include spacers positioned between the sheet adhesives and semiconductor devices or substrate.

Integrated circuit card

A memory card has a housing including an interior chamber and a top metal cover. A substrate is located in the interior chamber and carries printed circuit leads, packaged semiconductor devices connected to selected printed circuit leads, and a connector connected to selected printed circuit leads. The packaged semiconductor devices are spaced from the top metal cover and a thermal coupler is located between the top metal cover and the packaged semiconductor devices for coupling heat generated by the packaged semiconductor devices to the top metal cover.

Growing community of inventors

Houston, TX, United States of America

Alton D Carpenter