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Altan Akyurek

Peter Maier

Jurgen Schulz-Harder

For the manufacture of a power semiconductor module, one proceeds from a ceramic base board on which copper plates and copper conductor paths are fastened by a suitable method. The ceramic base plate is then scratched and broken. As a result, ceramic side boards are produced which are connected to the base board via conductive paths. The side boards are then swung up, as a result of which the conductive paths fastened on the side boards come into a plane above the base plane. By means of suitable, possibly multiple, breaking and folding of the side boards and suitable development of the ends of the conductive paths, the connecting poles of the power semiconductor chips can be directly contacted. Electronic circuits can be arranged on the side boards.

Semiconductor module with multi-plane conductive path

Aluminum nitride powder (28), possibly powdered glass (29) and aluminum oxide powder (23) are introduced into the molding cavity of a pressure matrix (26) for fabrication of a carrier body from aluminum nitride, whose surface is at least partially covered with aluminum oxide. Subsequently a pressure stamp (22) of the pressure tool (20) is introduced into the molded cavity of the pressure matrix (26). The powdered layers (28, 29, 30) are compressed and subsequently sintered, for instance for two hours at 1600.degree. C. in a neutral atmosphere.

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8560 Lauf/Pegn., Germany

Altan Akyurek