Applied Materials Israel Limited

Applied Materials, Inc.

Applied Materials Isreal Ltd

Appiled Materials, Inc.

Alon Litman

Benzion Sender

Efim Vinnitsky

Doron Meshulach

Konstantin Chirko

Gilad Almogy

Ron Naftali

Ehud Tirosh

Yehuda Zur

Meir Aloni

Jimmy Vishnipolsky

Albert Karabekov

Mula Friedman

Yoram Uziel

Steven Robert Rogers

Nir Ben-David Dodzin

Amir Shoham

Alex Goldenshtein

Nissim Elmaliach

Yonatan Lehman

Emanuel Elyasef

Juergen Frosien

Igor Petrov

Ilya Blayvas

Guy Eytan

Ofer Adan

Jacob Levin

Chris Talbot

Amir Wachs

Igor Krivts

Lior Yaron

Alexander Mairov

Itamar Shani

Gal Bruner

Ron Davidescu

Uri Lev

Zvi Nir

Konstantine Chirko

Yoav Nachum

Kfir Dotan

Yonatah Lehman

Arnon Mizrahy

Ofir Arzouan

A method of performing x-ray spectroscopy material analysis of a region of interest within a cross-section of a sample using an evaluation system that includes a focused ion beam (FIB) column, a scanning electron microscope (SEM) column, and an x-ray detector, including: forming a lamella having first and second opposing side surfaces in the sample by milling, with the FIB column, first and second trenches in the sample to expose the first and second sides surface of the lamella, respectively; depositing background material in the second trench, wherein the background material is selected such that the background material does not include any chemical elements that are expected to be within the region of interest of the sample; generating a charged particle beam with the SEM column and scanning the charged particle beam across a region of interest on the first side surface of the lamella such that the charged particle beam collides with the first side surface of the lamella at a non-vertical angle; and detecting x-rays generated while the region of interest is scanned by the charged particle beam.

X-ray imaging in cross-section using un-cut lamella with background material

A method and a system for detecting backscattered electrons in a multi-beam electron column.

Detecting backscattered electrons in a multibeam charged particle column

A method of evaluating a region of a sample that includes alternating layers of different material. The method includes milling, with a focused ion beam, a portion of the sample that includes the alternating layers of different material; reducing the milling area; and repeating the milling and reducing steps multiple times during the delayering process until the process is complete.

Adaptive geometry for optimal focused ion beam etching

A method, a non-transitory computer readable medium and a three-dimensional evaluation system for providing three dimensional information regarding structural elements of a specimen. The method can include illuminating the structural elements with electron beams of different incidence angles, where the electron beams pass through the structural elements and the structural elements are of nanometric dimensions; detecting forward scattered electrons that are scattered from the structural elements to provide detected forward scattered electrons; and generating the three dimensional information regarding structural elements based at least on the detected forward scattered electrons.

Generating three dimensional information regarding structural elements of a specimen

A method of evaluating a region of a sample that includes an array of holes separated by solid portions. The method includes positioning the sample within in a vacuum chamber of an evaluation tool that includes a scanning electron microscope (SEM) column and a focused ion beam (FIB); injecting a deposition gas onto the sample; scanning, with a first charged particle beam, a portion of the sample that includes a plurality of holes in the array of holes to locally deposit material within the plurality of holes in the scanned portion from the deposition gas; and milling, with the FIB column, the portion of the sample that includes the plurality of holes in which the material was locally deposited.

Filling empty structures with deposition under high-energy SEM for uniform DE layering

A method for evaluating a specimen, the method can include positioning an energy dispersive X-ray (EDX) detector at a first position; scanning a flat surface of the specimen by a charged particle beam that exits from a charged particle beam optics tip and propagates through an aperture of an EDX detector tip; detecting, by the EDX detector, x-ray photons emitted from the flat surface as a result of the scanning of the flat surface with the charged particle beam; after a completion of the scanning of the flat surface, positioning the EDX detector at a second position in which a distance between the EDX detector tip and a plane of the flat surface exceeds a distance between the plane of the flat surface and the charged particle beam optics tip; and wherein a projection of the EDX detector on the plane of the flat surface virtually falls on the flat surface when the EDX detector is positioned at the first position and when the EDX detector is positioned at the second position.

Retractable detector

A method and a charged particle beam system that includes charged particle beam optics and a movable stage; wherein the movable stage is configured to introduce a movement between the object and charged particle beam optics; wherein the movement is of a constant velocity and along a first direction; wherein the charged particle beam optics is configured to scan, by the charged particle beam, multiple areas of the object so that each point of the multiple areas is scanned multiple times; wherein the multiple areas partially overlap; wherein the scanning is executed by the charged particle beam optics; wherein the scanning comprises performing counter-movement deflections of the charged particle beam for at least partially compensating for the movement; and wherein each area of the multiple areas is scanned by following an area scan scheme that defines multiple scan lines that differ from each other.

System and method for scanning an object with an electron beam using overlapping scans and electron beam counter-deflection

A system and a method for evaluating a lithography mask, the system may include: (a) electron optics for directing primary electrons towards a pellicle that is positioned between the electron optics and the lithography mask; wherein the primary electrons exhibit an energy level that allows the primary electrons to pass through the pellicle and to impinge on the lithographic mask; (b) at least one detector for detecting detected emitted electrons and for generating detection signals; wherein detected emitted electrons are generated as a result of an impingement of the primary electrons on the lithographic mask; and (c) a processor for processing the detection signals to provide information about the lithography mask.

Inspection of a lithographic mask that is protected by a pellicle

A method for evaluating a specimen includes positioning a detector in an inserted position in which a first distance between a tip of the detector and a plane extending along a surface of the specimen is less than a distance between the plane and a tip of charged particle beam optics. While maintaining the detector at the inserted position, the surface of the specimen is scanned by a primary beam that exits from the tip of the charged particle beam optics. The detector detects x-ray photons and/or charged particles emitted or reflected from the specimen as a result of scanning the specimen with the primary beam. After completion of the scanning, the detector is positioned at a retracted position in which a second distance between the tip of the detector and the plane exceeds a distance between the tip of the charged particle beam optics and the plane.

Multi mode systems with retractable detectors

A system for electrically testing an object, the system may include a scanning electron microscope that comprises a column; and nano-probe modules that are mechanically connected to the column; wherein the column is configured to illuminate areas of the object, with a beam of charged particles; wherein nano-probes of the nano-probe modules are configured to electrically contact elements of the object, during electrical tests of the object, wherein the elements of the object are located within the areas of the object.

System for electrical measurements of objects in a vacuumed environment

A system for scanning a plurality of regions of interest of a substrate using one or more charged particle beams, the system comprises: an irradiation module having charged particle optics; a stage for introducing a relative movement between the substrate and the charged particle optics; an imaging module for collecting electrons emanating from the substrate in response to a scanning of the regions of interest by the one or more charged particle beams; and wherein the charged particle optics is arranged to perform countermovements of the charged particle beam during the scanning of the regions of interest thereby countering relative movements introduced between the substrate and the charged particle optics during the scanning of the regions of interest.

Inspection of regions of interest using an electron beam system

Multi mode system with a dispersion X-ray detector

A system that may include a first mechanical stage, a second mechanical stage, charged particle beam optics and a controller. The system may charge, with a charged particle beam, a slice of the object. During the charging of the slice the first mechanical stage may introduce a first movement along a first direction, between the object and charged particle beam optics. The charged particle beam optics may scan the slice with the charged particle beam. The scanning of the slice includes performing, by the charged particle optics, a first counter-movement deflection of the charged particle beam to at least partially counter the first movement. The second mechanical stage is configured to introduce a second movement along a second direction, between the object and the charged particle beam optics. Upon a completion of the charging of the slice, the second mechanical stage is configured to perform a first flyback operation.

Method for charging and imaging an object

A method that includes performing multiple test iterations to provide multiple test results; and processing the multiple test results to provide estimates of a conductivity of each of the multiple bottoms segments. The multiple test iterations includes repeating, for each bottom segment of the multiple bottom segments, the steps of: (a) illuminating the bottom segment by a charging electron beam; wherein electrons emitted from the bottom segment due to the illuminating are prevented from exiting the hole; (b) irradiating, by a probing electron beam, an area of an upper surface of the dielectric medium; (c) collecting electrons emitted from the area of the upper surface as a result of the irradiation of the area by the probing electron beam to provide collected electrons; and (d) determining an energy of at least one of the collected electrons to provide a test result.

Imaging bottom of high aspect ratio holes

Growing community of inventors

Nes-Ziona, Israel

Alon Litman