Intel Corporation

Alok Tripathi

Ken Drottar

Dennis J Miller

Michael W Leddige

Mark B Trobough

Yun Ling

Mohiuddin M Mazumder

Jason A Mix

Dave Dunning

Ven R Holalkere

Kent E Mallory

Pascal C Meier

An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable ('flex cable') secured to the PCB. The apparatus also includes a daughter card having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.

Technique for blind-mating daughtercard to mainboard

In some embodiments, a frequency dependent gain circuit is coupled to an output of an amplifier. The gain circuit provides at least two ranges of frequency dependent gain characteristics in response to the output of the amplifier. A control circuit provides one of the at feast two gain values as an output. Other embodiments are described and claimed.

Apparatus, system and method for receiver equalization

An apparatus that includes a first conducting strip having a narrowed width where the first conducting strip also acts as a first electrode for a first tapping capacitance. The first tapping capacitance has a second electrode that is: 1) parallel to the first conducting strip; and 2) closer to the first conducting strip than a second conducting strip. The second conducting strip is parallel to the first conducting strip and has a narrowed width where the second conducting strip also acts as a first electrode for a second tapping capacitance. The second tapping capacitance has a second electrode that is: 1) parallel to the second conducting strip; and 2) closer to the second conducting strip than the first conducting strip.

Design, layout and method of manufacture for a circuit that taps a differential signal

According to some embodiments, time domain reflectometry based transmitter equalization is provided. For example, a reflection detector in a transmitter may detect a reflection signal associated with a calibration signal that was transmitted via an interconnect. The reflection detector may then provide filter information to a transmitting unit to facilitate a transmission of data to a remote receiver via the interconnect. According to some embodiments, the receiver adjusts a termination impedance before the calibration signal is transmitted.

Time domain reflectometry based transmitter equalization

A technique to simultaneously reduce high-frequency insertion loss and cross-talk for a multi-layered add-in card is disclosed. The technique is based on selective removal of ground and power planes beneath the edge fingers. This selective removal of power and ground planes removes excess capacitance at the edge fingers, lowering the insertion loss at high frequencies, while maintaining an impedance match with an associated connector. Simultaneously, the leftover metallic ground/power plane provides electromagnetic shielding and thus reduces the cross-talk between the differential pairs. Optimum performance of the connector with minimized insertion loss and cross-talk can be obtained for high-speed analog and digital applications.

Add-in card edge-finger design/stackup to optimize connector performance

A method and apparatus for reducing electromagnetic emissions from a high-speed differential data connector is disclosed. The method and apparatus are as effective as a 360&deg; enclosure, while being easier and less expensive to manufacture and does not require a direct electrical connection between the Transistor-to-Transistor logic (TTL) or logic ground and the system chassis ground.

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Beaverton, OR, United States of America

Alok Tripathi