Seagate Technology Incorporated

Alok Dhawan

Jon Paul Hurley

A bottom surface of an optical component is bonded to a mounting surface. The bottom surface includes a first opaque feature and the mounting surface includes a second opaque feature. The first and second opaque features are hidden between the bottom surface and the mounting surface after the bonding. An infrared image is obtained through a top surface of the optical component that is opposed to the bottom surface. The infrared image includes a view of a region proximate first and second opaque features. One or more of an optical alignment and a bond line thickness between the optical component and the mounting surface is determined via the infrared image.

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Shakopee, MN, United States of America

Alok Dhawan