Epcos Ag

Alois Kleewein

Thomas Feichtinger

Christian Block

Sebastian Brunner

Robert Krumphals

Günter Pudmich

Holger Flühr

Heinz Ragossnig

An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.

Electrical multilayer component with reduced parasitic capacitance

An electrical component having multiple layers includes dielectric layers that are stacked to form a main body, electrodes positioned at intervals between at least some of the dielectric layers, and at least two bumps configured to act as electrical contacts for the electrical component. The bumps are on a surface of the main body. The electrical component also includes contacts in the main body that electrically connect bumps and electrodes. The electrodes define first and second electrode stacks, each of which contacts one of the bumps.

Electric multilayer component

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Graz, Austria

Alois Kleewein