Intel Corporation

Almanzo T Ortiz

Jeffory L Smalley

Tao Liu

Mani Prakash

Susan F Smith

Harvey R Kofstad

Henry C Bosak

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

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Chandler, AZ, United States of America

Almanzo T Ortiz