Henkel IP Holding Gmbh

Henkel Ag & Company, Kgaa

Henkel US IP Lcc

Henkel Corporation

Allison Yue Xiao

Jie Cao

Yayun Liu

Wenhua Huang

Bin Wei

Charles Willard Paul

Quinn K Tong

Gunther Dreezen

Andrea Keys Eodice

Shengqian Kong

Bodan Ma

Qili Wu

Donald Herr

Yimin Zhang

Sharon Chaplinsky

Xiaoyan Huang

Rudie Oldenzijl

Jianping Chen

Minghai Wang

Lirong Bao

Gyanendra Dutt

Jose Garcia-Miralles

Hao Kong

Hui Yang

A method for making a conductive network of sintered silver comprises preparing a conductive ink comprising a silver compound and a binder; depositing the conductive ink on a substrate and applying an external energy source to the deposited conductive ink to dry the ink; and applying an external energy source to the dried ink to decompose the ink to elemental silver and to sinter the elemental silver into a conductive network.

Conductive material and process

This invention is a flexible conductive ink composition comprising (A) a resin binder, (B) silver-plated core conductive particles, and (C) conductive particles having a surface area at least 1.0 m/g.

Flexible conductive ink

A one-pot process for the electroless-plating of silver onto graphite powder is disclosed. No powder pretreatment steps for the graphite, which typically require filtration, washing or rinsing, are required. The inventive process comprises mixing together three reactant compositions in water: an aqueous graphite activation composition comprising graphite powder and a functional silane, a silver-plating composition comprising a silver salt and a silver complexing agent, and a reducing agent composition.

Electroless plating of silver onto graphite

The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. The adhesives find particular use as case, carton, and tray forming, and as sealing adhesives, including heat sealing applications, for example in the packaging of cereals, cracker and beer products.

Adhesive compositions and use thereof

A radiation curable temporary laminating adhesive composition for use in temperature applications at 150&#xb0; C. or greater, and typically at 200&#xb0; C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.

Radiation curable temporary laminating adhesive for use in high temperature applications

A composition for use as a thermally conductive composition in a heat-generating electronic device is provided. The composition comprises physically treated fillers modified with a surface area modifying agent and one or more resins.

Thermally conductive composition

A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.

Phase separated curable compositions

A material for producing a conductive composition comprising polymer particles, conductive particles, and a liquid medium. The material is in a liquid/dispersion form until it is cured at which time it forms an electrically conductive composition. The composition contains larger sized polymer particles along with smaller metal conductive filler particles such as nanoparticle-sized filler particles. The larger polymer particles create excluded volume in the material matrix and reduce the percolation threshold of the conductive filler particles to provide a conductive material with a reduced volume fraction of electrically conductive filler. The electrical conductivity of the material is further increased after heat treatment which causes the conductive filler particles to sinter together to form a highly conductive network.

Conductive materials

A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole phosphate salt catalyst, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.

B-stageable underfill encapsulant and method for its application

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Belle Mead, NJ, United States of America

Allison Yue Xiao